Laser process for reliable and low-resistance electrical contacts
View Patent ↗Disclosed is a method for manufacturing an organic optoelectronic device. The method comprises providing a substrate, disposing a first electrode on the substrate, disposing a metal pad on the substrate, electrically separated from the first electrode, disposing a first material over the first electrode and at least partially over the metal pad, applying a beam, wherein the beam ablates the first material in an ablation window so that the ablation window includes at least a portion of an edge of the metal pad, and disposing a second electrode over the first material and over the ablation window so that the second electrode is in electrical contact with the at least a portion of an edge of the metal pad.
1. A method for manufacturing an organic optoelectronic device, comprising:
disposing a first electrode on a substrate;
disposing a metal pad on the substrate, electrically separated from the first electrode;
disposing at least a first material over the first electrode and at least partially over the metal pad;
directing a beam to ablate part of the first material to form an ablation window, the ablation window overlapping at least a portion of an edge of the metal pad; and
disposing a second electrode over the first material and in the ablation window so that the second electrode is in electrical contact with the portion of an edge of the metal pad.
2. The method according to claim 1 , wherein the beam is a laser beam.
3. The method according to claim 2 , wherein the laser beam includes ultraviolet light.
4. The method according to claim 1 , wherein the size of the beam is smaller than the ablation window and the beam is moved over the ablation window.
5. The method according to claim 1 , wherein the size of the beam is larger than the ablation window.
6. The method according to claim 1 , wherein the beam is applied through a mask to define the ablation window.
7. The method according to claim 1 , wherein the first material includes at least one of an organic material and an insulating material, the organic material comprising at least one of the group consisting of organic radiation-emitting material and organic radiation-detecting material.
8. The method according to claim 7 , wherein the organic material comprises at least one of an electron injection layer, an electron transportation layer, a hole injection layer, a hole transportation layer, or a light-emitting layer.
9. The method according to claim 1 , wherein the organic material comprises a material from the group consisting of organic monomers, organic oligomers, organic polymers, organic small molecules and combinations thereof.
10. The method according to claim 1 , wherein the metal pad includes metal-pad material comprising a material from the group consisting of copper, chromium and combinations thereof.
11. The method according to claim 1 , wherein the metal pad has at least in the area of the ablation window a shape with a higher circumference-to-surface ratio than the geometrical basic shape from which the shape of the metal pad is derived.
12. The method according to claim 11 , wherein the metal pad comprises an edge with at least one indentation.
13. The method according to claim 11 , wherein the metal pad comprises an edge with at least one convexity.
14. The method according to claim 11 , wherein the metal pad includes a hole which is enclosed by metal-pad material.
15. The method according to claim 1 , further comprising disposing a second material at least partially over the metal pad, wherein the beam additionally ablates the second material to form the ablation window.
16. The method according to claim 15 , wherein the second material includes at least one of an organic material and an insulating material, the organic material comprising at least one material from the group consisting of organic radiation-emitting material and organic radiation-detecting material.