Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
View Patent ↗A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.
1. A semiconductor apparatus having a structure in which one or more semiconductor parts and one or more conductive members are connected through electric conduction,
wherein a bonding layer containing silver is formed at a joint portion between the semiconductor part and the conductive member,
holes are formed in the bonding layer so as to be almost evenly dispersed in a whole area of the bonding layer,
a volume ratio occupied by the holes in the bonding layer is in a range from 5 vol % to 70 vol %, and
a joint structure is formed in which the semiconductor part and the bonding layer, and the joint portion and the conductive member are metallically bonded respectively using silver as a bonding material,
wherein silver is the main component of the metallic bond.
2. The semiconductor apparatus according to claim 1 ,
wherein the semiconductor part includes a power transistor element, and
the volume ratio occupied by the holes in the bonding layer is in a range from 20 vol % to 70 vol %.
3. The semiconductor apparatus according to claim 2 ,wherein a part of the conductive member and the semiconductor part are encapsulated with resin,
the semiconductor part is provided with a first electrode and a second electrode on a first main surface and a second main surface reverse to the first main surface, respectively,
a first conductive member of the conductive members is metallically bonded to the first electrode via the bonding layer,
a second conductive member of the conductive members is metallically bonded to the second electrode via the bonding layer,
the first conductive member and the second conductive member extend to outside of the resin, and
the volume ratio occupied by the holes in the bonding layer is in a range from 50 vol % to 70 vol %.
4. The semiconductor apparatus according to claim 1 ,wherein the semiconductor part includes elements for a high-frequency device,
a plurality of first electrodes are formed on a first main surface of the semiconductor part,
the semiconductor part is electrically connected to the conductive member via the plurality of first electrodes,
the plurality of first electrodes are metallically bonded to the conductive member via the bonding layer, and
the volume ratio occupied by the holes in the bonding layer is in a range from 5 vol % to 10 vol %.
5. The semiconductor apparatus according to claim 1 ,
wherein insulating resin is filled at least in a part of the holes.
6. The semiconductor device according to claim 1 ,
wherein the bonding layer is formed of one or more high-melting-point and well-conductive metal powders and a silver bonding material for coupling the metal powders.
7. The semiconductor device according to claim 6 ,
wherein a maximum particle diameter of the metal powders is 15 μm to 200 μm.
8. The semiconductor device according to claim 6 ,
wherein the metal powders are formed of either one of single metal powders of gold, silver, copper and nickel and composite metal powders obtained by coating an outermost surface of copper, nickel, aluminum, magnesium, molybdenum or tungsten serving as a core material with gold or silver.
9. A semiconductor apparatus having a structure in which one or more semiconductor parts and one or more conductive members are connected through electric conduction,
wherein a bonding layer is formed at a joint portion between the semiconductor part and the conductive member,
the bonding layer is formed of high-melting-point and well-conductive metal powders and a silver bonding material for coupling them, and
a joint structure is formed in which the semiconductor part and the bonding layer, and the joint portion and the conductive member are metallically bonded respectively with the silver bonding material,
wherein silver is the main component of the silver bonding material,
wherein a volume ratio occupied by holes in the bonding layer is in a range from 5 vol % to 70 vol %.
10. The semiconductor apparatus according to claim 9 ,
wherein a maximum particle diameter of the metal powders is 15 μm to 200 μm.
11. The semiconductor apparatus according to claim 9 ,
wherein the metal powders are formed of either one of single metal powders of gold, silver, copper and nickel and composite metal powders obtained by coating an outermost surface of copper, nickel, aluminum, magnesium, molybdenum or tungsten serving as a core material with gold or silver.