Passive alignment using elastic averaging in optoelectronics applications
View Patent ↗In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
1. A method of aligning components of an optoelectronic assembly comprising:
providing an optical coupler having a first beam port along a first surface and having a second beam port along a second surface;
providing a substrate having an optical element, said optical element being one of a light source and a light detector; and
linking said optical coupler to said substrate using a fixed array of rigid alignment features and a compliant array of flexible alignment features, by contacting the fixed array of rigid alignment features with the compliant array of flexible alignment features such that alignment is dependent primarily upon positional accuracy and frequency of said fixed array of rigid alignment features and secondarily upon compliancy of said compliant array of flexible alignment features when contacting said fixed array of rigid alignment features, said fixed array of rigid alignment features and said compliant array of flexible alignment features being on respective coupling surfaces of said optical coupler and said substrate.
2. The method of claim 1 , wherein providing said optical coupler includes forming said compliant array of flexible alignment features on said optical coupler and wherein providing said substrate includes forming said rigid alignment features thereon.
3. The method of claim 2 , wherein forming said fixed array of rigid alignment features includes patterning electrically passive solder bumps on said substrate such that said solder bumps are dedicated to precisely aligning said optical coupler to said substrate.
4. The method of claim 2 , wherein forming said fixed array of rigid alignment features includes forming openings through said substrate using integrated circuit fabrication techniques, said substrate being a semiconductor substrate.
5. The method of claim 2 , wherein forming said fixed array of rigid alignment features includes using integrated circuit fabrication techniques to provide raised regions, said substrate being a semiconductor substrate.
6. The method of claim 1 , wherein providing said optical coupler includes forming said fixed array of rigid alignment features on said optical coupler and wherein providing said substrate includes forming said compliant array of flexible alignment features on said substrate.
7. The method of claim 1 , wherein providing said optical coupler includes forming an array of said first beam ports on said first surface, said first and second surfaces being generally perpendicular to each other.