Non-coplanar high-speed interconnects
View Patent ↗In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.
1. A high-speed package comprising:
a first layer comprising first and second sets of coplanar transmission lines;
a second layer comprising third and fourth sets of coplanar transmission lines; and
a multi-channel non-coplanar interconnect comprising first and second channels, the first channel connecting the first set of transmission lines to the third set of transmission lines, the second channel connecting the second set of transmission lines to the fourth set of transmission lines.
2. The high-speed package as recited in claim 1 , wherein each channel of the multi-channel non-coplanar interconnect is capable of transmitting high-speed signals at a speed of about 25 G.
3. The high-speed package as recited in claim 1 , wherein each channel of the multi-channel non-coplanar interconnect comprises:
a first plane of ground transmission lines; and
a second plane of signal transmission lines, the second plan being substantially parallel to the first plane.
4. The high-speed package as recited in claim 1 , wherein the high-speed package comprises an integrated circuit package or an optoelectric circuit package.
5. The high-speed package as recited in claim 1 , wherein the first channel comprises an SS/GG channel.
6. The high-speed package as recited in claim 5 , wherein the second channel comprises an SS/GG channel.
7. The high-speed package as recited in claim 5 , wherein the second channel comprises an S/GG channel.
8. The high-speed package as recited in claim 5 , wherein the second channel comprises an SS/GGG channel.
9. A high-speed transponder comprising:
a printed circuit board comprising first and second sets of coplanar traces;
a first package mounted to the printed circuit board, the first package comprising first and seconds sets of coplanar transmission lines;
a first non-coplanar multi-channel interconnect comprising first and second channels, the first channel connecting the first set of traces to the first set of transmission lines, the second channel connecting the second set of traces to the second set of transmission lines.
a second package mounted to the printed circuit board, the second package comprising third and fourth sets of coplanar transmission lines; and
a second non-coplanar multi-channel interconnect comprising third and fourth channels, the third channel connecting the first set of traces to the third set of transmission lines, the fourth channel connecting the second set of traces to the fourth set of transmission lines.
10. The high-speed transponder as recited in claim 9 , wherein the high-speed transponder is capable of transmitting high-speed signals between the first and second packages at speeds of about 100 G.
11. The high-speed transponder as recited in claim 9 , wherein each channel of the non-coplanar multi-channel high-speed interconnect comprises:
a first plane of ground transmission lines; and
a second plane of signal transmission lines, the second plane being substantially parallel to the first plane.
12. The high-speed transponder as recited in claim 9 , wherein:
the first package comprises an integrated circuit package;
the second package comprises an optoelectric circuit package.
13. The high-speed transponder as recited in claim 9 , wherein the first and third channels each comprises an SS/GG channel.
14. The high-speed transponder as recited in claim 13 , wherein the second and fourth channels each comprises an SS/GG channel.
15. The high-speed transponder as recited in claim 13 , wherein the second and fourth channels each comprises an S/GG channel.
16. The high-speed transponder as recited in claim 13 , wherein the second and fourth channels each comprises an SS/GGG channel.
17. A high-speed transponder comprising:
a printed circuit board comprising first and second sets of coplanar traces;
an integrated circuit package mounted to the printed circuit board, the integrated circuit package comprising first and seconds sets of coplanar transmission lines;
a first non-coplanar multi-channel interconnect comprising first and second channels, the first channel connecting the first set of traces to the first set of transmission lines, the second channel connecting the second set of traces to the second set of transmission lines,
an optoelectric circuit package mounted to the printed circuit board, the optoelectric circuit package comprising third and fourth sets of coplanar transmission lines; and
a second non-coplanar multi-channel interconnect comprising third and fourth channels, the third channel connecting the first set of traces to the third set of transmission lines, the fourth channel connecting the second set of traces to the fourth set of transmission lines.
18. The high-speed transponder as recited in claim 17 , wherein the first and third channels each comprises an SS/GG channel.
19. The high-speed transponder as recited in claim 17 , wherein the high-speed transponder is capable of transmitting high-speed signals between the integrated circuit package and the optoelectric circuit package at speeds of about 100 G.
20. The high-speed transponder as recited in claim 17 , wherein each channel of the non-coplanar multi-channel high-speed interconnect comprises:
a first plane of ground transmission lines; and
a second plane of signal transmission lines that is substantially parallel to the first plane.