Gallium nitride semiconductor device
View Patent ↗A gallium nitride based semiconductor Schottky diode fabricated from a n+ doped GaN layer having a thickness between one and six microns disposed on a sapphire substrate; an n− doped GaN layer having a thickness greater than one micron disposed on said n+ GaN layer patterned into a plurality of elongated fingers and a metal layer disposed on the n− doped GaN layer and forming a Schottky junction therewith. The layer thicknesses and the length and width of the elongated fingers are optimized to achieve a device with breakdown voltage of greater than 500 volts, current capacity in excess of one ampere, and a forward voltage of less than three volts.
1. A method for fabricating a gallium based semiconductor diode, comprising:
providing a substrate;
forming an n+ doped GaN layer having a thickness between one and six microns on said substrate;
forming an n− GaN layer having a thickness greater than three microns on said n+ GaN layer;
depositing a first metal layer on said n− doped GaN layer so as to form a first Schottky junction therewith, resulting in said diode having a forward voltage of less than two volts with a current capacity of at least four amperes; and
patterning said n− doped layer into a sequence of parallel, elongated finger regions extending normally from a common central region in opposite directions.
2. The method as defined in claim 1 , further comprising depositing an ohmic metal layer over at least a portion of the n+ GaN layer so as to make ohmic contact with said n+ GaN layer and to form a contact bonding surface of the device.
3. The method of claim 2 wherein said ohmic metal layer is deposited over said finger regions.
4. The method of claim 1 wherein said finger regions provide for current transport within said diode.
5. The method as defined in claim 1 , wherein the width of each finger regions is approximately 50 microns and spacing between 5 and 150 microns so that the resulting diode has a breakdown voltage greater than 500V.
6. The method as defined in claim 1 , wherein the width of each finger regions is approximately 50 microns and spacing between 5 and 150 microns so that the resulting diode has a breakdown voltage between 200 and 500 volts.
7. The method as defined in claim 1 , further comprising depositing an aluminum contact layer over the first metal layer and extending over each of the finger regions so as to form a large, low resistance contact binding surface of the device.
8. The method as defined in claim 7 wherein said aluminum contact layer and said first metal layer are deposited simultaneously and are substantially of the same size.
9. The method as defined in claim 7 wherein said aluminum contact layer is substantially larger in size than the first metal layer.
10. The method of claim 9 wherein said first and second metal layers include one of the metals selected from the group comprising Ni, Pt, Au, Co Pd, Mo, Cr Rh, Re, PtSi and NiSi.
11. The method as defined in claim 1 further comprising thinning the substrate to a thickness less than 10 mils to reduce thermal resistance of the substrate for device heat dissipation.
12. The method as defined in claim 1 , further comprising depositing an AlGaN layer between said n-doped GaN layer and said first metal layer.
13. The method as defined in claim 1 further comprising depositing a second metal layer on said n− doped GaN layer so as to form a second Schottky junction.
14. The method of claim 1 further comprising placing a guard ring selectively on surface of said n− GaN layer.
15. The method of claim 1 further comprising placing a passivation layer selectively on surface of said n− GaN layer and on surface of said n+ GaN layer.
16. The method of claim 15 wherein said passivation layer covers the Schottky junction.
17. The method of claim 15 further comprising patterning said passivation layer to create bonding pad regions.
18. The method of claim 1 further comprising placing a passivation layer entirely over the n− GaN layer and the n+ GaN layer.