Glue application device for a labeling machine

1. Glue application device with at least one gluing roller ( 4 ) which can be driven in rotation around its roller axis, and with at least one glue application and spreading element ( 3 ) with a glue dispensing point which is in communication with a connection ( 16 ) for the delivery of the glue to apply glue on a cylindrical peripheral surface of the gluing roller ( 4 ) that concentrically surrounds the roller axis and is moved past the glue dispensing point, wherein said glue application device comprises a glue buffer chamber ( 13 ) which is in communication with the glue dispensing point at the gluing roller ( 4 ) and holds a buffer volume of glue.

2. Glue application device as recited in claim 1 , wherein said glue application device comprises a ventilation opening or a ventilation duct ( 22 ) for the release of air from said glue buffer chamber ( 13 ).

3. Glue application device as recited in claim 2 , wherein said glue application device comprises an overflow ( 14 ) formed between the connection ( 16 ) for the feed of the glue and the glue delivery ( 8 ) for the drainage of an excess quantity of glue not applied to the gluing roller ( 4 ) into an overflow duct ( 15 ), preferably into an overflow ( 15 ) which leads into a glue reservoir ( 21 ) that feeds the glue application device.

4. Glue application device as recited in claim 3 , wherein said ventilation opening or ventilation duct ( 22 ) is provided on the glue buffer chamber ( 13 ) and/or on the overflow ( 14 ).

5. Glue application device as recited in claim 4 , wherein the glue buffer chamber ( 13 ) is provided in the communication between the connection ( 16 ) for the feed of the glue and the glue dispensing point to the gluing roller ( 4 ).

6. Glue application device as recited in claim 5 , wherein the overflow ( 14 ) is connected to the buffer chamber ( 13 ).

7. Glue application device as recited in claim 6 , wherein:

the glue buffer chamber ( 13 ) is formed by a recess in a housing ( 3 . 1 ) or in a block ( 23 ) that forms this housing, and that the overflow ( 14 ) is formed by a widened portion of the recess that forms the glue buffer chamber ( 13 ) on the upper peripheral area of this recess; and

the connection ( 16 ) for the feed of the glue empties into the glue buffer chamber ( 13 ), preferably on the upper side of this chamber.

8. Glue application device as recited in claim 7 , wherein:

said glue application device comprises a glue duct ( 11 ) which is connected to the glue buffer chamber ( 13 );

the glue duct ( 11 ) empties on the bottom of the glue buffer chamber ( 13 ) of this chamber; and

said glue application device comprises a heater ( 6 ) in the glue application or distribution element ( 3 ).

9. Glue application device with at least one gluing roller ( 4 ) which can be driven in rotation around its roller axis, and with at least one glue application and spreading element ( 3 ) with a glue dispensing point which is in communication with a connection ( 16 ) for the delivery of the glue to apply glue on a cylindrical peripheral surface of the gluing roller ( 4 ) that concentrically surrounds the roller axis and is moved past the glue dispensing point, wherein said glue application device comprises an overflow ( 14 ) which is formed between the connection ( 16 ) for the feed and delivery of the glue ( 8 ) for the removal of an excess quantity of glue that is not deposited on the gluing roller ( 4 ) into an overflow duct ( 15 ), preferably into an overflow ( 15 ) that leads into a glue reservoir ( 21 ) that supplies the glue application device.

10. Glue application device as recited in claim 9 , wherein the glue dispensing point is formed by a glue chamber ( 8 ) which has the glue application and spreading element ( 3 ) in the vicinity of a contact surface ( 7 ) which is in contact against the peripheral surface of the gluing roller ( 4 ) and which is closed on its side facing the gluing roller ( 4 ) by the peripheral surface of the gluing roller ( 4 ).

11. Glue application device as recited in claim 10 , wherein a ventilation opening or a ventilation duct ( 22 ) is provided on the overflow ( 14 ).

12. Glue application device as recited in claim 11 , wherein:

the glue chamber ( 8 ) is realized in the form of an elongated chamber and is oriented with its longitudinal dimension parallel or approximately parallel to the roller axis of the gluing roller ( 4 );

said glue application device comprises a glue duct ( 11 ) which is connected to the glue chamber ( 8 );

the glue chamber ( 8 ) is connected with the glue duct ( 11 ) by means of a plurality of openings or borings ( 12 ); and

said glue application device comprises a heater ( 6 ) in the glue application or distribution element ( 3 ).

13. Glue application device with at least one gluing roller ( 4 ) which can be driven in rotation around its roller axis, and with at least one glue application and spreading element ( 3 ) with a glue dispensing point which is in communication with a connection ( 16 ) for the delivery of the glue to apply glue on a cylindrical peripheral surface of the gluing roller ( 4 ) that concentrically surrounds the roller axis and is moved past the glue dispensing point, wherein the glue dispensing point is formed by a glue chamber ( 8 ) which has the glue application and spreading element ( 3 ) in the vicinity of a contact surface ( 7 ) which is in contact against the peripheral surface of the gluing roller ( 4 ), and which is closed on its side facing the gluing roller ( 4 ) by the peripheral surface of the gluing roller ( 4 ), wherein said glue application device comprises a heater ( 6 ) disposed within the glue application or distribution element ( 3 ).

14. Glue application device as recited in claim 13 , wherein:

said glue application device comprises a glue buffer chamber ( 13 ) which is in communication with the glue dispensing point to the gluing roller ( 4 ), which buffer chamber ( 13 ) holds a buffer volume of glue;

said glue application device comprises a glue duct ( 11 ) which connects the glue chamber ( 8 ) with the glue buffer chamber ( 13 ); and

said heater ( 6 ) is disposed adjacent and to extend along said glue duct ( 11 ) to heat glue prior to entry into said glue chamber ( 8 ).

15. Glue application device as recited in claim 14 , wherein:

the glue chamber ( 8 ) is realized in the form of an elongated chamber and is oriented with its longitudinal dimension parallel or approximately parallel to the roller axis of the gluing roller ( 4 );

the glue chamber ( 8 ) is connected with the glue duct ( 11 ) by means of a plurality of openings or borings ( 12 );

said heater ( 6 ) is an elongated heater ( 6 ) disposed to extend along the length of said glue chamber ( 8 ) to heat glue being conducted through each of said plurality of openings or borings ( 12 ); and

each of said plurality of openings or borings ( 12 ) is disposed at substantially the same distance from said heater ( 6 ).

16. Glue application device as recited in claim 15 , wherein said glue application device comprises an overflow ( 14 ) formed between the connection ( 16 ) for the feed of the glue and the glue delivery ( 8 ) for the drainage of an excess quantity of glue not applied to the gluing roller ( 4 ) into an overflow duct ( 15 ), preferably into an overflow ( 15 ) which leads into a glue reservoir ( 21 ) that feeds the glue application device, and a ventilation opening or a ventilation duct ( 22 ) is connected directly to one of: the glue buffer chamber ( 13 ) and the overflow ( 14 ).

17. Glue application device as recited in claim 16 , wherein:

the glue buffer chamber ( 13 ) is provided in the communication between the connection ( 16 ) for the feed of the glue and the glue dispensing point ( 8 ) to the gluing roller ( 4 );

the overflow ( 14 ) is connected to the buffer chamber ( 13 ); and

the glue buffer chamber ( 13 ) is formed by a recess in a housing ( 3 . 1 ) or in a block ( 23 ) that forms this housing, and that the overflow ( 14 ) is formed by a widened portion of the recess that forms the glue buffer chamber ( 13 ) on the upper peripheral area of this recess.

18. Glue application device as recited in claim 17 , wherein:

the connection ( 16 ) for the feed of the glue empties into the glue buffer chamber ( 13 ), preferably on the upper side of this chamber;

the glue duct ( 11 ) empties on the bottom of the glue buffer chamber ( 13 ) of this chamber; and

said heater ( 6 ) is configured and disposed to maintain substantially constant temperature of the glue being conducted through each of said plurality of openings or borings ( 12 ) and into said glue chamber ( 8 ).

19. Glue application device as recited in claim 13 , wherein:

said glue application device comprises a plurality of openings or borings ( 12 ) through which glue is conducted into said glue chamber ( 8 ); and

said heater ( 6 ) is configured and disposed to maintain substantially constant temperature of the glue being conducted through each of said plurality of openings or borings ( 12 ) and into said glue chamber ( 8 ).

20. Glue application device as recited in claim 13 , wherein:

said glue application device comprises a plurality of openings or borings ( 12 ) through which glue is conducted into said glue chamber ( 8 );

said heater ( 6 ) is an elongated heater ( 6 ) disposed to extend along the length of said glue chamber ( 8 ) to heat glue being conducted through each of said plurality of openings or borings ( 12 ); and

each of said plurality of openings or borings ( 12 ) is disposed at substantially the same distance from said heater ( 6 ).