IP Library Granted Patent US 8,576,537
Granted Patent B2
US 8,576,537 · App. 12/253,598 · Granted Nov 5, 2013

Capacitor comprising flex crack mitigation voids

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Quick Facts
Patent No.
US 8,576,537
App. No.
12/253,598
Granted
Nov 5, 2013
Kind
B2
Abstract

A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.

Claims (18)

1. A capacitor comprising:

parallel plates of opposing polarity with a dielectric there between; and

at least one elongated crack mitigation void extending over only a portion of a width of said capacitor between a face of said capacitor and an outermost plate of said parallel plates wherein said elongated crack mitigation void has a height and a width wherein said height is larger than said width and said height is parallel to said plates.

2. The capacitor of claim 1 wherein said crack mitigation void is disposed in a plane parallel to said plates.

3. The capacitor of claim 1 comprising pillars or separations in said crack mitigation void.

4. The capacitor of claim 1 comprising a multiplicity of crack mitigation voids wherein the closest approach of adjacent crack mitigation voids is a smaller distance than a closest approach between a crack mitigation void and a closest plate of said parallel plates.

5. The capacitor of claim 1 comprising a multiplicity of crack mitigation voids.

6. The capacitor of claim 5 wherein said crack mitigation voids comprise struts there between.

7. The capacitor of claim 6 wherein said struts have a thickness which is less than a distance between said crack mitigation void and a closest plate of said parallel plates.

8. The capacitor of claim 1 wherein said crack mitigation void is parallel to a side of said capacitor.

9. The capacitor of claim 1 wherein said crack mitigation void is perpendicular to a side of said capacitor.

10. The capacitor of claim 1 wherein pairs of said parallel plates are coplanar.

11. The capacitor of claim 10 further comprising a conductive plate between adjacent sets of coplanar parallel plates.

12. A capacitor comprising:

parallel plates of opposing polarity with a dielectric there between; and

a multiplicity of crack mitigation voids extending partially into a width of said capacitor in said dielectric parallel to said plates and between a dielectric face of said capacitor and an outermost plate of said parallel plates wherein said crack mitigation voids have a height and a width wherein said height is larger than said width and said height is parallel to said plates.

13. The capacitor of claim 12 wherein said elongated crack mitigation voids are cylindrical.

14. The capacitor of claim 1 wherein said elongated crack mitigation void is cylindrical.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
SECURITY INTEREST Recorded Oct 5, 2010
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A. AS AGENT
Reel/Frame 025150/0023 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 022892/0795 Recorded May 18, 2010
From: K FINANCING, LLC
To: KEMET CORPORATION
Reel/Frame 024397/0774 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: KEMET CORPORATION
To: K FINANCING, LLC
Reel/Frame 022892/0795 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2008
From: PRYMAK, JOHN D.
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 021707/0172 →