IP Library Granted Patent US 8,259,930
Granted Patent B2
US 8,259,930 · App. 12/256,893 · Granted Sep 4, 2012

Waterproof structure and electronic equipment

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Quick Facts
Patent No.
US 8,259,930
App. No.
12/256,893
Granted
Sep 4, 2012
Kind
B2
Abstract

With a waterproof structure for the space between a first case and a diaphragm doubling as a display panel provided facing the first case, a first resilient member is integrally formed at a surface of the diaphragm facing the first case, and the first resilient member is press-fitted into a groove formed in a surface of the first case facing the diaphragm side.

Claims (36)

1. A waterproof structure comprising:

a first case,

a diaphragm doubling as a display panel provided corresponding to the first case and configured to emit sound by vibrating,

a first resilient member integrally formed at a surface of the diaphragm facing the first case, and

a driving device that transmits a vibration to the diaphragm and is housed within a space formed by the first case and the diaphragm,

wherein the first resilient member is press-fitted into a groove formed in a surface of the first case facing the diaphragm side.

2. The waterproof structure according to claim 1 , wherein the diaphragm and the first case are fixed using stepped screws via a second resilient member.

3. An electronic equipment equipped with the waterproof structure according to claim 1 .

4. The waterproof structure according to claim 1 , wherein the diaphragm, the first resilient member, and the first case form a sealed container enclosing the driving device.

5. A waterproof structure comprising:

a first case,

a diaphragm doubling as a display panel provided corresponding to the first case and configured to emit sound by vibrating,

a first resilient member integrally formed at a surface of the diaphragm facing the first case,

a second case having an opening within where the diaphragm is disposed, covering the first case, and

a center case housed within a space formed between the first case and the diaphragm,

wherein the first resilient member is press-fitted into a groove formed in a surface of the first case facing the diaphragm side,

the diaphragm is disposed within the opening of the second case, and

the first resilient member is fixed by the second case and is disposed between the diaphragm and the center case.

6. A waterproof structure comprising:

a first case,

a diaphragm doubling as a display panel provided corresponding to the first case and configured to emit sound by vibrating,

a first resilient member formed integrally with a film at a surface of the diaphragm facing the first case,

a second case having an opening within where the diaphragm is disposed, covering the first case, and

a center case housed within a space formed between the first case and the diaphragm,

wherein the first resilient member is press-fitted into a groove formed at a surface of the first case facing the diaphragm,

the diaphragm is disposed within the opening of the second case, and

the first resilient member is fixed by the second case and is disposed between the diaphragm and the center case.

7. A waterproof structure comprising:

a first case,

a diaphragm doubling as a display panel provided corresponding to the first case and configured to emit sound by vibrating, and

a first resilient member formed integrally with a film at a surface of the diaphragm facing the first case,

wherein the first resilient member is press-fitted into a groove formed at a surface of the first case facing the diaphragm.

8. The waterproof structure according to claim 7 , wherein the film is a flexible wiring substrate.

9. The waterproof structure according to claim 7 , wherein the diaphragm and the first case are fixed using stepped screws via a second resilient member.

10. An electronic equipment equipped with the waterproof structure according to claim 7 .

11. The waterproof structure according to claim 7 , wherein the diaphragm, the first resilient member, and the first case form a sealed container.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2014
From: NEC CORPORATION
To: LENOVO INNOVATIONS LIMITED (HONG KONG)
Reel/Frame 033720/0767 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2013
From: NEC CASIO MOBILE COMMUNICATION LTD.
To: NEC CORPORATION
Reel/Frame 030258/0429 →
MERGER Recorded Jul 16, 2010
From: CASIO HITACHI MOBILE COMMUNICATIONS, CO., LTD.
To: NEC CASIO MOBILE COMMUNICATIONS, LTD.
Reel/Frame 024700/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2008
From: KAWASAKI, YASUHIKO; KOYAMA, YUTAKA
To: CASIO HITACHI MOBILE COMMUNICATIONS CO., LTD.
Reel/Frame 021727/0113 →