Method for manufacturing printed wiring board

1. A method for manufacturing a printed circuit board including:

a single-layer or multilayer substrate having a surface provided with a mounting area for installing an electronic part thereon;

a plurality of bonding lands positioned in the mounting area for fixing electrodes of the electronic part, and

a wiring pattern connected to the bonding lands,

the method comprising steps of:

(o) measuring deformation of the substrate;

(p) calculating a position for the mounting area to be allocated based on the deformation measured in the step (o); and

(q) pattering the bonding lands and the wiring pattern by correcting an originally allocated position of the mounting area based on the calculated position in the step (p), so that the bonding lands has a predetermined pitch according to dimensions of the electronic part regardless of the deformation of the substrate.

2. The method for manufacturing a printed circuit board according to claim 1 ,

wherein the substrate has a via hole therein, the method further comprising:

calculating in the step (p) a position for a via land to be patterned based on the deformation measured in the step (o);

forming the via land around an opening of the via hole on the surface of the substrate by correcting an originally designed position thereof based on the calculated position in the step (p).

3. The method for manufacturing a printed circuit board according to claim 1 ,

wherein the patterning in step (q) comprises:

forming a resist layer for covering a conductive layer on the surface of the substrate;

exposing the resist layer by applying light thereon so as to draw a predetermined pattern;

removing part of the resist layer and leaving a predetermined pattern by development; and

patterning the conductive layer by removing part of the conductive layer exposed through the predetermined pattern of the resist layer, by etching.

4. The method for manufacturing a printed circuit board according to claim 1 , wherein the substrate includes a plurality of measuring references located at predetermined positions in a designed coordinate system for the substrate, and in the step (o), the deformation of the substrate is measured by detecting the positions of the plurality of measuring references, the step (p) including:

comparing detected positions of the measuring references with the predetermined positions of the measuring references to obtain deformation data; and

converting the designed coordinate system into a corrected coordinate system based on the deformation data.

5. A method for manufacturing a printed circuit board including a first substrate formed of an insulation material, a first wiring pattern formed on a surface of the first substrate, a second substrate formed of an insulation material overlaid on at least one surface of the first substrate, a second wiring pattern formed on a surface of the second substrate, and a via hole formed in the second substrate to provide an electrical connection between the first wiring pattern and the second wiring pattern, the method comprising steps of:

(j) measuring deformation of a laminated body composed of the first substrate and the second substrate;

(k) calculating a position for the via hole to be formed in the second substrate based on the deformation of the laminated body measured in the step (j);

(l) forming the via hole by correcting an originally designed position thereof in the second substrate based on the calculated position in the step (k); and

(m) forming a via land around an opening of the via hole on the surface of the second substrate before or after the step (l),

wherein the step (m) includes calculating a position for the via land to be patterned based on the deformation measured in the step (j), the via land being patterned by correcting an originally designed position thereof by the calculated position.

6. The method for manufacturing a printed circuit board according to claim 5 , further comprising a step of:

(n) forming a plurality of bonding lands in a mounting area for mounting an electronic part on the surface of the second substrate, before, after, or during the step (l), the plurality of bonding lands being electrically connected to the second wiring pattern, electrodes of the electronic part being fixed to the plurality of bonding lands,

wherein in the step (n), the plurality of bonding lands are patterned to have a predetermined pitch in accordance with dimensions of the electronic part regardless of the deformation of the laminated body.

7. The method for manufacturing a printed circuit board according to claim 6 , further comprising:

calculating a position for the mounting area to be allocated based on the deformation of the laminated body measured in the step (j), and

wherein in the step (n), an originally designed the position of the mounting area is corrected based on the calculated position such that the plurality of bonding lands are patterned with the predetermined pitch regardless of the deformation of the laminated body.

8. The method for manufacturing a printed circuit board according to claim 5 ,

wherein the forming in step (m) comprises:

forming a resist layer for covering a conductive layer on the surface of the second substrate;

exposing the resist layer by applying light thereon so as to draw a predetermined pattern;

removing part of the resist layer and leaving a predetermined pattern by development; and

patterning the conductive layer by removing part of the conductive layer exposed through the predetermined pattern of the resist layer, by etching.

9. The method for manufacturing a printed circuit board according to claim 5 , wherein the laminated body includes a plurality of measuring references located at predetermined positions in a designed coordinate system for the laminated body, and in the step (j), the deformation of the laminated body is measured by detecting the positions of the plurality of measuring references, the step (k) including:

comparing detected positions of the measuring references with the predetermined positions of the measuring references to obtain deformation data; and

converting the designed coordinate system into a corrected coordinate system based on the deformation data.

10. A method for manufacturing a printed circuit board including a first substrate formed of an insulation material, a first via hole formed in the first substrate, and a first via land formed on a surface of the first substrate around an opening of the first via hole, the method comprising steps of:

(a) measuring deformation of the first substrate having the first via hole formed therein;

(b) calculating a position for the first via land to be patterned based on the deformation of the first substrate measured in the step (a);

(c) patterning the first via land on the surface of the first substrate by correcting an originally designed position thereof based on the calculated position in the step (b);

(d) forming a laminated body by overlaying a second substrate formed of an insulation material on at least one surface of the first substrate;

(e) measuring deformation of the laminated body;

(f) calculating a position for a second via hole to be formed based on the deformation of the laminated body measured in the step (e);

(g) forming the second via hole in the second substrate by correcting an originally designed position based on the calculated position in the step (f);

(h) forming on a surface of the second substrate a second via land around an opening of the second via hole, and a second wiring pattern; and

(i) forming a plurality of bonding lands on the surface of the second substrate in a mounting area for mounting an electronic part, before, after, or during the step (h), the plurality of bonding lands being electrically connected to the second wiring pattern, and electrodes of the electronic part being fixed to the plurality of bonding lands,

wherein in the step (i), the plurality of bonding lands are arranged to have a predetermined pitch in accordance with dimensions of the electronic part regardless of the deformation of the laminated body.

11. The method for manufacturing a printed circuit board according to claim 10 ,

wherein the step (b) further calculates a position for a first wiring pattern to be formed on the surface of the first substrate at the same time as calculating the position for the first via land, and in the step (c), both of the first via land and the first wiring pattern are patterned by correcting respective originally designed positions based on the calculated positions in the step (b).

12. The method for manufacturing a printed circuit board according to claim 10 ,

wherein a plurality of measuring references are provided on the first substrate, and in the step (a), the deformation of the first substrate is measured by detecting the positions of the plurality of measuring references.

13. The method for manufacturing a printed circuit board according to claim 10 ,

wherein the measurement of the deformation of the first substrate in the step (a) and the measurement of the deformation of the laminated body in the step (e) are both performed on the basis of common measurement references reference provided in the first substrate.

14. The method for manufacturing a printed circuit board according to claim 10 ,

wherein the step (h) includes calculating a position for the second via land to be patterned based on the deformation measured in the step (e), and the second via land is patterned by correcting an originally designed position thereof based on the calculated position.

15. The method for manufacturing a printed circuit board according to claim 10 , further comprising:

calculating a position for the mounting area to be allocated based on the deformation of the laminated body measured in the step (e),

wherein in the step (i), an originally designed position of the mounting area is corrected based on the calculated position such that the plurality of bonding lands are patterned with the predetermined pitch regardless of the deformation of the laminated body.

16. The method for manufacturing a printed circuit board according to claim 10 ,

wherein the patterning in the step (c) comprising steps of:

forming a resist layer for covering a conductive layer on the surface of the first substrate;

exposing the resist layer by applying light thereon so as to draw a predetermined pattern;

removing part of the resist layer and leaving a predetermined pattern by development; and

patterning the conductive layer by removing part of the conductive layer exposed through the predetermined pattern of the resist layer, by etching.

17. The method for manufacturing a printed circuit board according to claim 12 , wherein the plurality of measuring references have predetermined positions in a designed coordinate system for the first substrates, the steps (b) and (f) each including:

comparing detected positions of the measuring references with the predetermined positions of the measuring references to obtain deformation data; and

converting the designed coordinate system into a corrected coordinate system based on the deformation data.