C0G multi-layered ceramic capacitor

1. A method for forming a capacitor comprising:

milling to a D50 of less than 1.0 μm a material comprising:

[(CaO) t (SrO) 1-t ] m [(ZrO 2 ) v (TiO 2 ) 1-v]

wherein m is 0.98 to 1.02; and

t is 0.50 to 0.90; and

v is 0.8 to 1.0;

thereby forming a first component (C1);

milling MnO 2 , MnCO 3 or another oxidized form of Mn to a D50 of less than 1.0 μm thereby forming a second component (C2);

milling SiO 2 to a D50 of less than 0.50 μm thereby forming a third component (C3);

combining said first component, said second component and said third component with a solvent in a ratio C1 1-α-β C2 α C3 β thereby forming a coating solution;

applying said coating solution to a tape in an amount selected from the group consisting of a) sufficient to form a ceramic layer over 4.5 μm thick wherein α and β are defined as 0.000186≦β≦0.08, 0.0001≦α≦0.043 and β≧1.86α; and b) sufficient to form a ceramic layer of no more than 4.5 μm thick wherein α and β are defined as 0.0000667≦β≦0.0533, 0.0001≦α≦0.08 and β≦0 667α;

drying said coating solution to form a green coating;

depositing an ink comprising electrode material over said green coating to form electroded green layers;

stacking non-electroded green layers and electroded green layers to form a green capacitor stack;

dicing said capacitor stack to form singular green multilayer chips;

firing said singular green multilayer chips in an atmosphere with a PO 2 of 10 −6 to 10 −16 ; and

forming terminals in electrical contact with said electrode material.

2. The method of claim 1 further comprising:

combining MnO 2 and said SiO 2 and milling said combination prior to said combining.