Multi-cavity vacuum electron beam device for operating at terahertz frequencies
View Patent ↗The present invention relates to the formation of a vacuum electronics circuit by the fusion bonding of multiple substrate wafers, e.g., silicon, copper, or other suitable conductive material, each etched using DRIE, cut using EDM, or machined by other suitable means. Other aspects of the invention relate to the alignment of a cathode with tube by fusion bonding the cathode wafer to a tube built using the fabrication methods described herein. Yet other aspects involve the alignment of dies or wafers during the fabrication of a vacuum electronics device using the “lego” technique outlined herein. In yet other aspects, fabrication methods are described.
1. A terahertz vacuum electronic device comprising:
a drift tube;
at least one set of input resonant cavities and associated input coupling waveguide structures located coaxially with the drift tube;
at least one set of output resonant cavities and associated output coupling waveguide structures located coaxially with the drift tube;
an electron source; and
an electron sink/collector;
wherein said vacuum electronic device is configured for operation as a high frequency terahertz device; and
wherein at least one of said input resonant cavities and said output resonant cavities are fabricated with less than a 1 μm tolerance in dimensions so as to achieve said terahertz operating frequency.
2. The vacuum electronic device of claim 1 , wherein said device is a klystron.
3. The vacuum electronic device of claim 1 , wherein the electron source is a field emitter array (FEA) or pseudo-spark gap.
4. The vacuum electronic device of claim 1 , wherein at least one of said input resonant cavities or said output resonant cavities are substantially cylindrical in shape and comprise a narrow, capacitive center section and a wide, inductive outer section.
5. The vacuum electronic device of claim 1 , wherein at least one of said input resonant cavities or said output resonant cavities are substantially cylindrical in shape and have a maximum diameter of 400 μm, with less than 1 μm tolerance.