Element with optical marking, manufacturing method, and use
View Patent ↗A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.
1. A labeled electronic component, comprising:
a first region comprising a first material made of plastic, the first region being a layer or a body made of the first material; and
at least one lift-off layer applied to the first region, the at least one lift-off layer comprising a second material that comprises silicon or germanium;
wherein the at least one lift-off layer is at least partially lifted-off in a lift-off area,
wherein the lift-off area forms a pattern,
wherein the at least one lift-off layer is electrically nonconducting or semiconducting,
wherein the pattern that is formed in the lift-off area of the at least one lift-off layer is a machine-readable label of the labeled electronic component,
wherein the at least one lift-off layer comprises a conglomerate of nanoparticles of at least two different materials, and
wherein the at least one lift-off layer comprises electrically conducting and nonconducting nanoparticles.
2. The layer combination according to claim 1 , wherein the lift-off area of the at least one lift-off layer forms an optically detectable contrast.
3. The layer combination according to claim 1 , wherein the at least one lift-off layer and the first region present different absorption properties.
4. The layer combination according to claim 1 , wherein the at least one lift-off layer has a thickness between about 0.005 and about 0.50 μm.
5. The layer combination according to claim 1 , wherein the first region comprises a component cover or a component casing.
6. The layer combination according to claim 1 , wherein a surface of the first region can produce increased scattering of a laser beam directed on it, compared to the at least one lift-off layer.
7. The layer combination according to claim 6 , wherein the surface of the first region comprises a roughened surface.
8. The layer combination according to claim 1 , wherein the at least one lift-off layer comprises a homogeneous layer produced by CVD or PVD.
9. The layer combination according to claim 1 , wherein the nanoparticles comprise thermochromic or photochromic materials.
10. The layer combination according to claim 1 , wherein the layer combination is applied to a surface of a component that works with surface acoustic waves or with bulk acoustic waves.
11. A component in combination with the layer combination according to claim 1 , comprising a component chip that includes the first region as an uppermost function layer of the component, wherein the at least one lift-off layer is arranged over the uppermost function layer of the component.
12. The layer combination according to claim 1 , wherein the at least one lift-off layer and the first region present different reflection properties.
13. A method for producing a labeled electronic component with a machine-readable pattern on a surface of a first region, the method comprising:
applying at least one lift-off layer on the surface of the first region; and
subsequently, using a laser beam to form a pattern in a lift-off area of the lift-off layer, the pattern being formed by at least a partial lifting off of the lift-off layer;
wherein the first region comprises a first material made of plastic, the first region being a layer or a body made of the first material;
wherein the at least one lift-off layer applied to the first region comprises a second material that comprises silicon or germanium;
wherein the at least one lift-off layer is at least partially lifted-off in the lift-off area,
wherein the lift-off area forms a pattern,
wherein the at least one lift-off layer is electrically nonconducting or semiconducting,
wherein the pattern that is formed in the lift-off area of the at least one lift-off layer is a machine-readable label of the labeled electronic component,
wherein the at least one lift-off layer comprises a conglomerate of nanoparticles,
wherein the at least one lift-off layer comprises a conglomerate of nanoparticles of at least two different materials, and
wherein the at least one lift-off layer comprises electrically conducting and nonconducting nanoparticles.
14. The method according to claim 13 , wherein applying the lift-off layer comprises depositing the lift-off layer from a gas phase or from a plasma.
15. The method according to claim 13 , wherein applying the lift-off layer comprises performing a spray application of a suspension of nanoparticles.
16. The method according to claim 14 , wherein applying the lift-off layer comprises applying a silicon or germanium layer with a layer thickness of 0.005-0.50 μm, and wherein using a laser beam comprises using a green laser.
17. The method according to claim 13 , wherein the lift-off layer and the laser beam are chosen in such a way that laser absorption within the lift-off layer is greater than in the first layer.
18. The method according to claim 13 , further comprising roughening the surface of the first region before applying the lift-off layer to increase scattering of the laser beam.
19. The method according to claim 13 , wherein using the laser beam comprises removing the lift-off layer until the surface of the first layer is uncovered.
20. The method according to claim 13 , wherein the lift-off layer is applied to the surface of a covered or encased component, which works with surface acoustic waves or bulk acoustic waves.
21. The method according to claim 13 ,
wherein the lift-off layer is applied on the surface of a cover film,
wherein the cover film is applied for covering and as a protective film on a component that works with surface acoustic waves or bulk acoustic waves, and
wherein the pattern is formed subsequently.
22. A method of marking a component, the method comprising:
providing a miniaturized electrical or electronic component having a first region; and
forming a layer over a surface of the first region of the component, the layer including a machine readable pattern formed by removing regions of the layer;
wherein the first region and the layer form a layer combination;
wherein the first region comprises a first material made of plastic, the first region being a layer or a body made of the first material;
wherein the layer comprises at least one lift-off layer applied to the first region, the at least one lift-off layer comprising a second material that comprises silicon or germanium;
wherein the at least one lift-off layer is at least partially lifted-off in a lift-off area;
wherein the lift-off area forms a pattern;
wherein the at least one lift-off layer is electrically nonconducting or semiconducting,
wherein the pattern that is formed in the lift-off area of the at least one lift-off layer is a machine-readable label of the labeled electronic component,
wherein the at least one lift-off layer comprises a conglomerate of nanoparticles,
wherein the at least one lift-off layer comprises a conglomerate of nanoparticles of at least two different materials, and
wherein the at least one lift-off layer comprises electrically conducting and nonconducting nanoparticles.
23. The method according to claim 22 , wherein the component comprises a surface acoustic wave component or bulk acoustic wave component with a height of less than 500 μm.
24. The method according to claim 22 , wherein the component comprises a surface acoustic wave component or bulk acoustic wave component with a height of less than 1500 μm.