Photoelectric conversion device and photodetector apparatus having the same

1. A photoelectric conversion device comprising:

an intrinsic semiconductor layer comprising:

at least one of an amorphous semiconductor layer; and

at least one of crystalline semiconductor layer including a plurality of crystals;

a first conductive type semiconductor layer disposed on a first side of the intrinsic semiconductor layer; and

a second conductive type semiconductor layer disposed on a second side of the intrinsic semiconductor layer opposite the first side.

2. The photoelectric conversion device of claim 1 , wherein a thickness of the amorphous semiconductor layer is equal to or less than approximately 1 micrometer.

3. The photoelectric conversion device of claim 1 , wherein

the first conductive type semiconductor layer comprises a p-type semiconductor layer, and

the second conductive type semiconductor layer comprises an n-type semiconductor layer.

4. The photoelectric conversion device of claim 3 , wherein

the amorphous semiconductor layer and the crystalline semiconductor layer are disposed directly on each other, and

the first conductive type semiconductor layer and the amorphous semiconductor layer are disposed directly on each other.

5. The photoelectric conversion device of claim 3 , wherein a band gap energy of the first conductive type semiconductor layer is greater than a band gap energy of the intrinsic semiconductor layer.

6. The photoelectric conversion device of claim 1 , wherein the first conductive type semiconductor layer, the second conductive type semiconductor layer and the intrinsic semiconductor layer comprise silicon.

7. The photoelectric conversion device of claim 1 , wherein a thickness of the first conductive type semiconductor layer has a range of approximately 200 angstroms to approximately 1000 angstroms.

8. The photoelectric conversion device of claim 3 , further comprising a reflecting layer which faces the intrinsic semiconductor layer,

wherein the second conductive type semiconductor layer is disposed between the intrinsic semiconductor layer and the reflecting layer.

9. The photoelectric conversion device of claim 8 , wherein the reflecting layer comprises an embossing pattern formed on a surface which faces the intrinsic semiconductor layer.

10. The photoelectric conversion device of claim 1 , wherein a thickness of the amorphous semiconductor layer is not equal to a thickness of the crystalline semiconductor layer.

11. A photodetector apparatus comprising:

a base substrate;

a photoelectric conversion device disposed on the base substrate and comprising:

an intrinsic semiconductor layer comprising:

at least one of an amorphous semiconductor layer; and

at least one of a crystalline semiconductor layer including a plurality of crystals;

a first conductive type semiconductor layer disposed on a first surface of the intrinsic semiconductor layer; and

a second conductive type semiconductor layer disposed on a second opposite surface of the intrinsic semiconductor layer;

a bias line disposed on the base substrate and electrically connected to the photoelectric conversion device to apply a bias signal to the photoelectric conversion device; and

a signal line disposed on the base substrate to output a current from the photoelectric conversion device, wherein the photoelectric conversion device receives a light from an external source,

the light causes a photoelectric conversion reaction in the photoelectric conversion device, and

the photoelectric conversion device outputs the current based on the photoelectric conversion reaction and the bias signal.

12. The photodetector apparatus of claim 11 , further comprising a fluorescent member disposed on the photoelectric conversion device to convert the light applied to the photoelectric conversion device from the external source into a visible light.

13. The photodetector apparatus of claim 11 , wherein a thickness of the amorphous semiconductor layer is equal to or less than approximately 1 micrometer.

14. The photodetector apparatus of claim 11 , wherein

the first conductive type semiconductor layer comprises a p-type semiconductor layer, and

the second conductive type semiconductor layer comprises an n-type semiconductor layer.

15. The photodetector apparatus of claim 11 , wherein a thickness of the first conductive type semiconductor layer has a range of approximately 200 angstroms to approximately 1000 angstroms.

16. The photodetector apparatus of claim 14 , wherein a band gap energy of the first conductive type semiconductor layer is greater than a band gap energy of the intrinsic semiconductor layer.

17. The photodetector apparatus of claim 11 , wherein the first conductive type semiconductor layer, the second conductive type semiconductor layer and the intrinsic semiconductor layer comprise silicon.

18. The photodetector apparatus of claim 14 , wherein

the photoelectric conversion device further comprises a reflecting layer which faces the intrinsic semiconductor layer, and

the second conductive type semiconductor layer is disposed between the intrinsic semiconductor layer and the reflecting layer.

19. The photodetector apparatus of claim 18 , wherein the reflecting layer comprises an embossing pattern formed on a surface which faces the intrinsic semiconductor layer.

20. The photodetector apparatus of claim 11 , wherein a thickness of the amorphous semiconductor layer is not equal to a thickness of the crystalline semiconductor layer.

21. The photodetector apparatus of claim 11 , further comprising a thin film transistor disposed on the base substrate and electrically connected to one of the first conductive type semiconductor layer and the second conductive type semiconductor layer to provide the current from the photoelectric conversion device to the signal line.

22. The photodetector apparatus of claim 14 , wherein

the amorphous semiconductor layer and the crystalline semiconductor layer are disposed directly on each other, and

the first conductive type semiconductor layer and the amorphous semiconductor layer are disposed directly on each other.

23. The photoelectric conversion device of claim 1 , wherein a diameter of a crystal of the plurality of crystals is equal to or less than approximately 100 angstroms.

24. The photodetector apparatus of claim 11 , wherein each crystal of the plurality of crystals has a diameter equal to or less than approximately 100 angstroms.