Method and apparatus for forming copper indium gallium chalcogenide layers
View Patent ↗A multilayer structure to form absorber layers for solar cells. The multilayer structure includes a base comprising a contact layer on a substrate layer, a first layer on the contact layer, and a metallic layer on the first layer. The first layer includes an indium-gallium-selenide film and the gallium to indium molar ratio of the indium-gallium-selenide film is in the range of 0 to 0.8. The metallic layer includes gallium and indium without selenium. Additional selenium is deposited onto the metallic layer before annealing the structure for forming an absorber.
1. A process of forming a Group IBIIIAVIA absorber on a base, comprising:
forming a first layer comprising an indium-gallium-selenide compound film on the base;
forming a metallic layer on the first layer, the metallic layer comprising a Group IB metal, a Group IIIA metal and another Group IIIA metal without a Group VIA material, wherein the base is at a substantially ambient temperature when the metallic layer is formed, and wherein the first layer and the metallic layer are distinct layers with no substantial reaction therebetween during the forming of the metallic layer; and
reacting the first layer, the metallic layer and a Group VIA material.
2. The process of claim 1 , wherein the first layer further comprises a first metal film of a Group IB metal, wherein the indium-gallium-selenide compound material film is deposited over the first metal film at a substantially ambient temperature.
3. The process of claim 1 , wherein forming the metallic layer comprises:
depositing a copper film onto the first layer;
depositing a gallium film onto the copper film; and
depositing an indium film onto the gallium film.
4. The process of claim 3 , wherein forming the metallic layer further comprises depositing another copper film onto the indium film.
5. The process of claim 1 , wherein the gallium to indium molar ratio of the indium-gallium-selenide compound film is in the range of 0 to 0.8.
6. The process of claim 1 , wherein a molar ratio of gallium to indium in the metallic layer is in the range of 0.2 to 0.3.
7. The process of claim 1 , wherein the step of reacting comprises depositing a Group VIA material on the metallic layer, thereby forming a pre-absorber structure, and heating the pre-absorber structure 200-600° C.
8. The process of claim 2 , wherein the step of forming the first layer comprises electrodepositing a copper film on the base and electrodepositing the (In,Ga)Se compound film on the copper film.
9. The process of claim 1 , wherein the step of forming the first layer comprises electrodepositing the (In,Ga)Se compound film on the base.
10. The process of claim 9 , wherein forming the metallic layer comprises:
electrodepositing a copper film onto the (In, Ga) Se compound film;
electrodepositing a gallium film onto the copper film; and
electrodepositing an indium film onto the gallium film.
11. The process of claim 10 , wherein forming the metallic layer further comprises electrodepositing another copper film onto the indium film.
12. The process of claim 8 , wherein forming the metallic layer comprise electrodepositing a copper-indium-Gallium alloy film onto the (In, Ga) Se compound film.