Feed thru with flipped signal plane using guided vias
View Patent ↗An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.
1. A high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing, wherein the first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device, the high speed feed thru comprising:
an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit;
an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit;
a material separating the inside coplanar structure and the outside coplanar structure; and
at least one guided via extending through the material, wherein the at least one guided via connects the inside coplanar structure and the outside coplanar structure and wherein a signal plane of the inside coplanar structure is flipped with respect to a signal plane of the outside coplanar structure.
2. A high speed feed thru according to claim 1 , wherein the at least one guided via carrying a signal is surrounded by at least one ground via.
3. A high speed feed thru according to claim 1 , wherein the outside coplanar structure is further connected to a printed circuit board including a set of coplanar high speed traces and, wherein the second circuit is connected to the set of coplanar high speed traces.
4. A high speed feed thru according claim 1 , wherein the high speed feed thru is an integral part of a transponder or a transceiver.
5. A high speed feed thru according to claim 1 , wherein:
the inside coplanar structure includes a single-ended ground-signal-ground (GSG) structure with strong coupling or a differential pair ground-signal-signal-ground (GSSG) structure with strong coupling;
the outside coplanar structure includes a single-ended GSG structure with strong coupling or a differential pair GSSG structure with strong coupling.
6. A high speed feed thru according claim 1 , wherein the first circuit comprises at least one of an optical circuit or an integrated circuit and the second circuit comprises at least one of an optical circuit or an integrated circuit.
7. A high speed feed thru according to claim 1 , wherein the feed thru is configured to relay signals at or greater than about 25 Gb/s.
8. A high speed feed thru according to claim 1 , wherein the first circuit comprises a first temperature control circuit and the second circuit comprises a second temperature control circuit.
9. A high speed feed thru according to claim 8 , wherein the first temperature control circuit includes the second temperature control circuit.
10. A high speed feed thru according to claim 1 , wherein an impedance of the at least one guided via is controlled using a pad at one or both ends of the at least one guided via to connect the at least one guided via to the outside coplanar structure and the inside coplanar structure.
11. A high speed feed thru according to claim 10 , wherein impedance of the at least one guided via is 50 Ohms for single-ended configurations or 100 Ohms for differential configurations.