Ball grid array package enhanced with a thermal and electrical connector
View Patent ↗Ball grid array (BGA) packages are provided. A BGA package includes a substrate that has a surface and a stiffener that has a surface and a protruding portion. The surface of the substrate has an opening therein. The protruding portion is located on the surface of the stiffener. The surface of the stiffener is coupled to the surface of the substrate. The protruding portion extends through the opening. An area of the surface of the stiffener is less than an area of the surface of the substrate. A surface of the protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB.
1. A ball grid array (BGA) package, comprising:
a substrate that has a surface, wherein said surface has an opening therein;
a stiffener that has a first surface and a protruding portion, wherein the protruding portion is located on said first surface of said stiffener, wherein the first surface of said stiffener is coupled to said surface of said substrate, wherein said protruding portion extends through said opening, wherein an area of said first surface of said stiffener is less than an area of said surface of said substrate;
an IC die mounted to a second surface of said stiffener; and
a wirebond coupled to a bond pad on said IC die and said second surface of the stiffener;
wherein a surface of said protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB and wherein said IC die has first and second opposing surfaces, wherein said first surface of said IC die is coupled to said second surface of said stiffener, wherein said first and second surfaces of said IC die are located outside of said opening.
2. The package of claim 1 , further comprising:
an encapsulate material that encapsulates said IC die on said second surface of said stiffener.
3. The package of claim 2 , further comprising:
a dam attached to said surface of said substrate around said IC die;
wherein the encapsulate material is formed according to a glob top encapsulation process within a boundary of said dam.
4. The package of claim 2 , wherein the encapsulate material is formed according to an over-mold encapsulation process.
5. The package of claim 2 , wherein a saw-singulation process is used to form an edge of said encapsulate material.
6. The package of claim 1 , wherein said stiffener has an edge, wherein at least a portion of said edge is patterned.
7. The package of claim 1 , wherein said protruding portion has a height such that said protruding portion extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB.
8. The package of claim 1 , further comprising:
a sealant material that substantially fills a gap around said protruding portion between said protruding portion and said substrate in said opening.
9. The package of claim 1 , wherein the opening is defined by a wall of the substrate and wherein a gap separates the protruding portion from the wall.
10. The package of claim 1 , wherein the second surface of the stiffener is substantially planar.