Method of manufacturing imprint substrate and imprinting method
View Patent ↗In a method of manufacturing an imprint substrate, a concave pattern, which is recessed, is formed on a top surface of the mold substrate. A light blocking layer is formed on the concave pattern and the top surface of the mold substrate. After bonding an adhesive substrate to the mold substrate such that the adhesive substrate faces the mold substrate, the adhesive substrate is separated from the mold substrate, so that the light blocking layer on the top surface is removed from the mold substrate. An imprint substrate having the light blocking layer only on the concave pattern is formed.
1. A method of manufacturing an imprint substrate, the method comprising:
receiving a mold substrate formed therein with a concave pattern recessed from a top surface of the mold substrate;
forming a light blocking layer on the concave pattern and the top surface of the mold substrate;
bonding the mold substrate to an adhesive substrate such that the light blocking layer formed on the top surface contacts the adhesive substrate; and
forming a light blocking pattern on the concave pattern by separating the adhesive substrate from the mold substrate to partially remove portions of the light blocking layer contacting the adhesive substrate.
2. The method of claim 1 , wherein the adhesive substrate comprises an epoxy resin.
3. The method of claim 2 , further comprising, prior to the bonding the mold substrate, curing the epoxy resin to a degree of cure of about 70% or less by heating the adhesive substrate.
4. The method of claim 3 , further comprising, prior to the separating the adhesive substrate, secondarily curing the epoxy resin to a degree of cure of about 70% or more by heating the adhesive substrate.
5. The method of claim 1 , wherein the mold substrate comprises quartz.
6. The method of claim 1 , wherein the light blocking layer comprises a metal thin film and is deposited on the mold substrate.
7. The method of claim 1 , wherein the light blocking pattern is formed on surfaces defining the concave pattern.
8. An imprinting method comprising:
forming an imprint substrate;
receiving a processing substrate having a photoresist film formed thereon;
providing the imprint substrate on the photoresist film;
pressing the imprint substrate against the photoresist film; and
removing the photoresist film corresponding to a top surface of the imprint substrate through a photolithography process employing the imprint substrate as a mask, wherein
the forming of the imprint substrate comprises:
receiving a mold substrate formed therein with a concave pattern recessed from a top surface of the mold substrate;
forming a light blocking layer on the concave pattern and the top surface of the mold substrate;
bonding the mold substrate to an adhesive substrate such that the light blocking layer formed on the top surface contacts the adhesive substrate; and
forming a light blocking pattern on the concave pattern by separating the adhesive substrate from the mold substrate to partially remove portions of the light blocking layer contacting the adhesive substrate.
9. The imprinting method of claim 8 , wherein the adhesive substrate comprises an epoxy resin.
10. The imprinting method of claim 9 , further comprising, prior to the bonding the mold substrate to an adhesive substrate, initiating a first cure of the epoxy resin to a degree of cure of about 70% or less by heating the adhesive substrate.
11. The imprinting method of claim 10 , further comprising, prior to the separating, initiating a second cure of the epoxy resin to a degree of cure of about 70% or above by heating the adhesive substrate.
12. The imprinting method of claim 8 , wherein the mold substrate comprises quartz.
13. The imprinting method of claim 8 , wherein the photoresist film comprises a positive-type photoresist.
14. A method of manufacturing a thin film transistor substrate, the method comprising:
preparing a mold substrate with a concave pattern recessed from a top surface of the mold substrate;
forming a light blocking layer on the concave pattern and the top surface of the mold substrate;
preparing an adhesive substrate facing the mold substrate;
bonding the mold substrate to the adhesive substrate such that the light blocking layer formed on the top surface makes contact with the adhesive substrate;
forming a light blocking pattern on the concave pattern of the mold substrate by separating the adhesive substrate from the mold substrate to partially remove the light blocking layer;
sequentially forming a gate electrode, a gate insulating layer, a silicon layer, a metal layer, and a photoresist film on a substrate;
providing an imprint substrate on the photoresist film;
forming a convex pattern, which corresponds to the concave pattern formed on the imprint substrate, on the photoresist film by pressing the imprint substrate against the mold substrate;
forming a photoresist pattern on the metal layer by exposing and developing the photoresist film using the imprint substrate as a mask, so as to partially remove the photoresist film; and
forming a silicon pattern, a source electrode, and a drain electrode on the gate insulating layer by etching the metal layer and the silicon layer using the photoresist pattern as a mask.
15. The method of claim 14 , wherein the mold substrate comprises a protrusion part that extends from a bottom surface of the concave pattern and is lower than the top surface.
16. The method of claim 15 , wherein the photoresist pattern is formed with a convex part corresponding to the protrusion part, and the metal layer is removed from a portion of the photoresist pattern corresponding to the protrusion part.
17. The method of claim 14 , wherein the adhesive substrate comprises an epoxy resin.
18. The method of claim 14 , wherein the photoresist film comprises a positive-type photoresist.