Process monitor for monitoring an integrated circuit chip

1. A system for monitoring an integrated circuit chip, comprising:

a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip; and

a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a temperature of the integrated circuit chip.

2. The system of claim 1 , wherein the first circuit and the second circuit are fully disposed on the integrated circuit chip.

3. The system of claim 1 , further comprising an analog multiplexer configured to multiplex the first signal and the second signal.

4. A system for monitoring an integrated circuit chip, comprising:

a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip; and

a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a power supply voltage of the integrated circuit chip.

5. The system of claim 4 , wherein the first circuit and the second circuit are fully disposed on the integrated circuit chip.

6. The system of claim 4 , further comprising an analog-to-digital converter configured to receive the first signal and the second signal and to produce a digital representation of the first signal and a digital representation of the second signal.

7. A system for monitoring an integrated circuit chip, comprising:

a first circuit at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a temperature of the integrated circuit chip;

a second circuit at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a power supply voltage of the integrated circuit chip; and

a third circuit at least partially disposed on the integrated circuit chip and configured to produce a third signal, wherein the third signal is indicative of a measure of a manufacturing process-dependent circuit parameter of the integrated circuit chip.

8. The system of claim 7 , wherein the first circuit and the second circuit are fully disposed on the integrated circuit chip.

9. The system of claim 7 , further comprising a controller configured to receive the first signal and the second signal and to produce a fourth signal to cause an adjustment of an operation performed on the integrated circuit chip.

10. The system of claim 9 , wherein the controller is disposed outside of the integrated circuit chip.

11. A system for monitoring an integrated circuit chip, comprising:

a first sensor at least partially disposed on the integrated circuit chip and configured to produce a first signal, wherein the first signal is indicative of a measure of a first manufacturing process-dependent circuit parameter;

a second sensor at least partially disposed on the integrated circuit chip and configured to produce a second signal, wherein the second signal is indicative of a measure of a second manufacturing process-dependent circuit parameter;

an analog multiplexer configured to multiplex the first signal and the second signal; and

an analog-to-digital converter configured to receive, from the analog multiplexer, the first signal and the second signal and to produce a digital representation of the first signal and a digital representation of the second signal.

12. The system of claim 11 , wherein the first sensor, the second sensor, the analog multiplexer, and the analog-to-digital converter are fully disposed on the integrated circuit chip.

13. The system of claim 11 , further comprising a controller configured to receive the digital representation of the first signal and the digital representation of the second signal and to produce a third signal to cause an adjustment of an operation performed on the integrated circuit chip.

14. The system of claim 11 , wherein the first manufacturing process-dependent circuit parameter is a gate-to-source threshold voltage of a transistor disposed on the integrated circuit chip.

15. The system of claim 11 , wherein the first manufacturing process-dependent circuit parameter is a transconductance of a transistor disposed on the integrated circuit chip.

16. The system of claim 11 , wherein the first manufacturing process-dependent circuit parameter is a sheet resistance of a resistor disposed on the integrated circuit chip.

17. A system for monitoring an integrated circuit chip, comprising:

a first circuit disposed on the integrated circuit chip and configured to determine a measure of a manufacturing process-dependent circuit parameter, to convert the measure of the manufacturing process-dependent circuit parameter into a first signal, and to communicate the first signal to a controller; and

a second circuit disposed on the integrated circuit chip and configured to receive a second signal from the controller and to cause an adjustment of an operation performed on the integrated circuit chip, wherein the adjustment is in response to the measure of the manufacturing process-dependent circuit parameter.

18. The system of claim 17 , wherein the first circuit and the second circuit are fully disposed on the integrated circuit chip.

19. The system of claim 17 , wherein the controller is disposed outside of the integrated circuit chip.

20. The system of claim 17 , wherein the adjustment is a change to a resistance of a part of a circuit that realizes the operation performed.