Systems, methods, and apparatus for combined superconducting magnetic shielding and radiation shielding
View Patent ↗A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil that is coupled to a current source. One or more measurement devices are responsive to magnetic fields in close proximity to the device, allowing compensation by controlling current to the compensation coil. Thus, magnetic shielding may be provided by compensation fields that may be trapped within the shielded enclosure when the system is cooled below the critical temperature of the second material. Radiation shielding may be provided by cooling the shielded enclosure to a temperature that is approximately equal to the temperature of the device.
1. A shielding system comprising;
a thermal radiation shield that is formed by a first material that has a high thermal conductivity, wherein at least a portion of the first material is plated with a second material that is superconductive below a critical temperature;
at least one thermal contact between the first material and a refrigeration system;
a current control system that includes at least one electrical current source;
a first compensation coil formed by a conductive current path that is conductively coupled to the current control system;
a first measurement device positioned to measure magnetic fields within the thermal radiation shield, the first measurement device communicatively coupled to the current control system; and
a second measurement device that is communicatively coupled to the current control system.
2. The shielding system of claim 1 wherein the first measurement device includes a magnetometer.
3. The shielding system of claim 1 wherein the first material includes copper metal.
4. The shielding system of claim 1 wherein the second material includes tin metal.
5. The shielding system of claim 1 , further comprising a device for which shielding from magnetic fields and shielding from infrared radiation are desired, wherein the device is at least partially contained within the thermal radiation shield.
6. The shielding system of claim 5 wherein the device includes a superconducting processor.
7. The shielding system of claim 6 wherein the device includes a superconducting quantum processor.
8. The shielding system of claim 1 wherein the second measurement device includes a magnetometer and wherein the first and the second measurement devices measure approximately perpendicularly to one another.
9. The shielding system of claim 1 , further comprising at least a third measurement device that is communicatively coupled to the current control system.
10. The shielding system of claim 9 wherein at least two measurement devices measure approximately perpendicularly to one another.
11. A shielding system comprising:
a thermal radiation shield that is formed by a first material that has a high thermal conductivity, wherein a portion of the first material is plated with a second material that is superconductive below a critical temperature;
at least one thermal contact between the first material and a refrigeration system;
a current control system that includes at least one electrical current source;
a first compensation coil formed by a conductive current path that is conductively coupled to the current control system;
a first measurement device positioned to measure magnetic fields within the thermal radiation shield, the first measurement device communicatively coupled to the current control system; and
at least a second compensation coil formed by a conductive current path, wherein each compensation coil is conductively coupled to the current control system,
wherein at least two compensation coils are aligned approximately perpendicular to one another.
12. A shielding system, comprising:
a thermal radiation shield that is formed by a first material that has a high thermal conductivity, wherein a portion of the first material is plated with a second material that is superconductive below a critical temperature;
at least one thermal contact between the first material and a refrigeration system;
a current control system that includes at least one electrical current source, wherein the current control system includes at least one signal amplifier;
a first compensation coil formed by a conductive current path that is conductively coupled to the current control system; and
a first measurement device positioned to measure magnetic fields within the thermal radiation shield, the first measurement device communicatively coupled to the current control system.
13. A shielding system, comprising:
a thermal radiation shield that is formed by a first material that has a high thermal conductivity, wherein a portion of the first material is plated with a second material that is superconductive below a critical temperature;
at least one thermal contact between the first material and a refrigeration system;
a current control system that includes at least one electrical current source, wherein the current control system includes at least one analog-to-digital converter;
a first compensation coil formed by a conductive current path that is conductively coupled to the current control system; and
a first measurement device positioned to measure magnetic fields within the thermal radiation shield, the first measurement device communicatively coupled to the current control system.
14. The shielding system of claim 1 wherein both an inner surface and an outer surface of the thermal radiation shield are plated with the second material.
15. The shielding system of claim 1 wherein the thermal radiation shield is approximately cylindrical in geometry.
16. A method of shielding a device from magnetic fields and infrared radiation, the method comprising:
at least partially enclosing the device within a thermal radiation shield, wherein the thermal radiation shield is formed by a first material that has a high thermal conductivity, and wherein a portion of the first material is plated with a second material that is superconductive below a critical temperature;
measuring the magnetic fields in a first direction in close proximity to the device by a first measurement device;
measuring magnetic fields in a second direction by a second measurement device;
controlling a first current through a first compensation coil to generate a first compensation field;
controlling a second current through a second compensation coil to generate a second compensation field;
monitoring the magnetic fields in the first direction;
refining the first current until the magnetic fields in the first direction reach a desired level;
monitoring the magnetic fields in the second direction;
refining the second current until the magnetic fields in the second direction reach a desired level;
trapping the first compensation field within the thermal radiation shield;
trapping the second compensation field within the thermal radiation shield; and
cooling the first material that forms the thermal radiation shield to a temperature that is approximately equal to the temperature of the device via at least one thermal contact between the first material and a refrigeration system.
17. The method of claim 16 wherein the device includes a superconducting processor.
18. The method of claim 17 wherein the device includes a superconducting quantum processor.
19. The method of claim 16 wherein trapping includes cooling the material that forms the thermal radiation shield to a temperature below the critical temperature of the second material, such that the second material becomes superconducting.
20. The method of claim 16 , further comprising:
deactivating the current once the first and the second compensation fields have been trapped.