Method of manufacturing display apparatus

1. A method of manufacturing a display apparatus, comprising:

bonding a first display substrate to a first carrier substrate, the first carrier substrate comprising a plurality of divided regions;

bonding a second display substrate to a second carrier substrate;

coupling the first display substrate with the second display substrate;

separating the second carrier substrate from the second display substrate;

cutting the first display substrate and the second display substrate at locations corresponding to the plural divided regions; and

separating the first carrier substrate from the first display substrate.

2. The method of claim 1 , wherein bonding the first display substrate to the first carrier substrate comprises:

aligning the first carrier substrate comprising the plural divided regions and attaching an adhesive member to the first display substrate; and

bonding the first carrier substrate to the first display substrate by using the adhesive member.

3. The method of claim 1 , wherein bonding the first display substrate to the first carrier substrate comprises:

marking a cutting line on the first carrier substrate, the cutting line defining the plural divided regions;

attaching an adhesive member to the first display substrate; and

bonding the first display substrate to the first carrier substrate by using the adhesive member.

4. The method of claim 3 , wherein the cutting line is one of a groove, a scratch, and a line.

5. The method of claim 3 , wherein cutting the first display substrate and the second display substrate comprises cutting the first carrier substrate, the first display substrate, and the second display substrate along the cutting line.

6. The method of claim 1 , wherein coupling the first display substrate with the second display substrate comprises:

forming a sealing line on one of the first display substrate and the second display substrate;

disposing liquid crystal in a closed loop defined by a sealing line; and

coupling the first display substrate with the second display substrate, the liquid crystal being disposed between the first display substrate and the second display substrate.

7. The method of claim 1 , wherein the first display substrate comprises a connection pad corresponding to each divided region.

8. The method of claim 7 , further comprising cutting a portion of the second display substrate corresponding to the connection pad after cutting the first display substrate and the second display substrate.

9. The method of claim 8 , further comprising connecting a driver to the connection pad after cutting the portion of the second display substrate.

10. The method of claim 1 , wherein bonding the second display substrate to the second carrier substrate comprises:

attaching an adhesive member to the second display substrate; and

bonding the second display substrate to the second carrier substrate by using the adhesive member.

11. The method of claim 1 , further comprising coupling a first polarization plate with the second display substrate before separating the first carrier substrate from the first display substrate.

12. The method of claim 1 , further comprising coupling a first polarization plate to the first display substrate after separating the first carrier substrate from the first display substrate.

13. The method of claim 1 , further comprising forming a thin film transistor on the first display substrate after bonding the first display substrate to the first carrier substrate.

14. The method of claim 1 , further comprising forming a color filter on the second display substrate after bonding the second display substrate to the second carrier substrate.

15. A method of manufacturing a display apparatus, comprising:

bonding a first display substrate to a first carrier substrate;

bonding a second carrier substrate comprising a plurality of divided regions to a second display substrate comprising a connection pad corresponding to each divided region;

coupling the first display substrate with the second display substrate;

separating the first carrier substrate from the first display substrate;

cutting the first display substrate and the second display substrate at locations corresponding to the plural divided regions; and

separating the second carrier substrate from the second display substrate.

16. The method of claim 15 , wherein bonding the second carrier substrate to the second display substrate comprises:

attaching an adhesive member to the second display substrate; and

bonding the second carrier substrate to the second display substrate by using the adhesive member.

17. The method of claim 15 , wherein bonding the second carrier substrate to the second display substrate comprises:

marking a cutting line on the second carrier substrate, the cutting line defining the plural divided regions;

attaching an adhesive member to the second display substrate; and

bonding the second carrier substrate to the second display substrate by using the adhesive member.

18. The method of claim 15 , wherein separating the second carrier substrate from the second display substrate comprises:

coupling a first polarization plate with the first display substrate;

separating the second carrier substrate from the second display substrate; and

coupling a second polarization plate with the second display substrate.

19. The method of claim 15 , further comprising after cutting the first display substrate and the second display substrate:

cutting a portion of the first display substrate corresponding to the connection pad; and

connecting a driver to the connection pad.

20. The method of claim 15 , further comprising before coupling the first display substrate with the second display substrate:

forming a color filter on the first display substrate; and

forming a thin film transistor on the second display substrate.