Interconnect device with discrete in-line components
View Patent ↗An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.
1. An interconnect device comprising:
a body having a first surface and a second surface opposite and substantially parallel to the first surface;
a well defined within the body and oriented substantially perpendicular to the first and second surfaces, the well having a first opening at the first surface and a second opening at the second surface;
a two-terminal discrete component inserted within the well, the two-terminal discrete component including first and second conductive ends and first and second terminals affixed, respectively, to the first and second conductive ends;
a first surface pad positioned on the first surface and coupled to the first terminal of the discrete component; and
a second surface pad positioned on the second surface and coupled to the second terminal of the discrete component,
wherein the two-terminal discrete component is configured to electrically couple a first conductive contact to a second conductive contact.
2. The interconnect device of claim 1 , wherein the first and second surface pads are soldered, respectively, to the first and second terminals of the discrete component.
3. The interconnect device of claim 2 , wherein at least one of the first and second surface pads is configured to interface with a corresponding solder ball of one of: a Ball Grid Array (BGA) device and a printed circuit board.
4. The interconnect device of claim 1 , wherein the discrete component comprises one of:
a resistor;
a capacitor;
a diode;
an inductor;
a fuse;
a battery;
a conductive polymer; and
a conductive spring.
5. The interconnect device of claim 1 , wherein at least one of the first and second discrete component terminals includes at least one of:
a conductive metal;
a conductive spring;
a pliable material; and
a conductive polymer.
6. The interconnect device of claim 1 , wherein at least one of the first and second discrete component terminals is affixed to a body portion of the discrete component by operation of a spring mechanism.
7. The interconnect device of claim 1 , wherein at least one of the first and second surface pads is configured to couple to at least one of a Ball Grid Array (BGA) device and a printed circuit board.
8. The interconnect device of claim 1 , wherein the discrete component further comprises:
a body portion having first and second ends affixed, respectively, to the first and second discrete component terminals.
9. The interconnect device of claim 8 , further comprising:
a collar formed of non-conductive material and disposed about the body portion, the collar being configured to hold the discrete component within the well.
10. The interconnect device of claim 9 , wherein the body portion comprises one of:
a resistor;
a capacitor;
a diode;
an inductor;
a conductive spring;
a battery; and
a fuse.
11. The interconnect device of claim 8 , wherein the body portion, first terminal and second terminal are contained in a unitary structure.
12. The interconnect device of claim 1 , wherein the discrete component comprises one of:
a press-fit component;
a spring loaded discrete component (SLDC); and
a conductive end cap component (CECC).
13. The interconnect device of claim 12 , wherein the press-fit component comprises:
a body portion; and
a collar formed of non-conductive material and disposed about the body portion, the collar being configured to hold the body portion within the well.
14. The interconnect device of claim 12 , wherein the spring-loaded discrete component (SLDC) comprises:
a spring mechanism affixing at least one of the first and second terminals to a body portion of the SLDC.
15. The interconnect device of claim 12 , wherein the conductive end-cap component (CECC) comprises:
a body portion having first and second ends affixed, respectively, to the first and second terminals,
wherein at least one of the first and second terminals comprises a pliable conductive material.
16. The interconnect device of claim 1 , wherein:
the two-terminal discrete device is hermetically sealed within the well.
17. The interconnect device of claim 16 , wherein at least one of:
the first surface pad is a solderable pad; and
the second surface pad is a solderable pad.
18. The interconnect device of claim 17 , wherein at least one of the first and second solderable pads is configured to be coupled to one of a respective solder ball of a Ball Grid Array (BGA) device and a respective solder pad of a printed circuit board.
19. A spring-loaded component, comprising:
a body portion comprising at least one electrical component, the body portion having a longitudinal length and first and second ends;
a first conductive terminal having a recess at a first end thereof;
a second conductive terminal having a recess at a first end thereof;
a first conductive coil spring having first and second ends, the first end of the first spring affixed to the first end of the body portion and the second end of the first spring affixed within the recess of the first terminal; and
a second conductive coil spring having first and second ends, the first end of the second spring affixed to the second end of the body portion and the second end of the second spring affixed within the recess of the second terminal,
wherein each of the first and second springs is oriented in-line with the longitudinal length of the body portion.
20. The spring-loaded component of claim 19 , wherein at least one of the first and second terminals includes solderable material.
21. The spring-loaded component of claim 19 , wherein the body portion comprises one of:
a resistor;
a capacitor;
a diode;
an inductor;
a battery; and
a fuse.
22. A discrete component, comprising:
a body portion having a longitudinal length and first and second ends; and
first and second terminals affixed, respectively, to the first and second ends of the body portion, wherein each of the first and second terminals comprises a conductive and pliable material, and
wherein the body portion includes one of:
a resistor;
an inductor;
a capacitor;
a diode;
a battery; and
a fuse,
wherein the discrete component is configured for insertion in a well of an interconnect device.
23. The discrete component of claim 22 , wherein the second terminal comprises a conductive and pliable material.
24. The discrete component of claim 22 , wherein:
at least one of the first and second terminals is affixed to the body portion by at least one of a conductive glue and a conductive epoxy.
25. The discrete component of claim 22 , wherein:
at least one of the first and second terminals is mechanically attached to the body portion.