IP Library Granted Patent US 8,009,435
Granted Patent B2
US 8,009,435 · App. 12/265,906 · Granted Aug 30, 2011

Card level enclosure system having enhanced thermal transfer and improved EMI characteristics

Assignee: Lockheed Martin Corp.
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Quick Facts
Patent No.
US 8,009,435
App. No.
12/265,906
Granted
Aug 30, 2011
Kind
B2
Abstract

An enclosure or containment system for expansion cards includes first and second sub-enclosures that interengage to form an enclosure assembly that substantially surrounds the major surface areas of the expansion card while providing support along some of the edges thereof to provide a protected volume that physically protects and shields the electronic and electrical components on the expansion card while providing enhanced heat transfer therefrom.

Claims (14)

1. An enclosure system for substantially enclosing an expansion card therein of the type having an edge connector at a front portion thereof and having a rear edge on a side opposite the front portion thereof, the connector having with a plurality of spaced conductive elements for connection to socket or socket-like receptacle on a motherboard comprising:

a substantially closed housing defining an interior volume for containing a substantial portion of an expansion card therein, the housing including a first sub-housing having a rear portion and a front portion and a second sub-housing having a rear portion and a front portion, the rear portion of the first sub-housing and the rear portion of the second sub-housing having interengaging formations for connecting the rear portions of the first and second sub-housings together and for defining a channel for receiving a rear edge portion of an expansion card therein, the respective front portions of the first sub-housing and the second sub-housings holding a portion of the expansion card rearwardly of the connector therebetween, and

a first end plate attached to respective first ends of said first and second sub-housings and a second plate attached to respective second ends of said first and second sub-housings.

2. The enclosure system of claim 1 , wherein the interengaging formations comprise a first cleat on the first sub-housing defining a first slot and a second cleat on the second sub-housing defining a second slot, the first cleat received in the second slot and the second cleat received in the first slot.

3. The enclosure system of claim 1 , further comprising fins extending outwardly of said sub-housings for exchanging heat therefrom with the surrounding atmosphere.

4. An expansion card/enclosure system for connection to socket or socket-like receptacle on a motherboard comprising:

a substantially closed housing defining an interior volume for containing a substantial portion of an expansion card therein, the expansion card of the type having an edge connector at a front portion thereof and having a rear edge on a side opposite the front portion thereof, the connector having with a plurality of spaced conductive elements, the housing including a first sub-housing having a rear portion and a front portion and a second sub-housing having a rear portion and a front portion, the rear portion of the first sub-housing and the rear portion of the second sub-housing having interengaging formations for connecting the rear portions of the first and second sub-housings together and for defining a channel for receiving a rear edge portion of an expansion card therein, the respective front portions of the first sub-housing and the second sub-housings holding a portion of the expansion card rearwardly of the connector therebetween, and

a first end plate attached to respective first ends of said first and second sub-housings and a second plate attached to respective second ends of said first and second sub-housings.

5. The enclosure system of claim 4 , wherein the interengaging formations comprise a first cleat on the first sub-housing defining a first slot and a second cleat on the second sub-housing defining a second slot, the first cleat received in the second slot and the second cleat received in the first slot.

6. The enclosure system of claim 4 , further comprising fins extending outwardly of said sub-housings for exchanging heat therefrom with the surrounding atmosphere.

7. An enclosure system for substantially enclosing an expansion card therein of the type having an edge connector at a front portion thereof and having a rear edge on a side opposite the front portion thereof, the connector having with a plurality of spaced conductive elements for connection to socket or socket-like receptacle on a motherboard comprising:

a substantially closed housing defining an interior volume for containing a substantial portion of an expansion card therein, the housing including a rear portion and a front portion, the rear portion having a channel for receiving a rear edge portion of an expansion card therein, the respective front portions of the first sub-housing and the second sub-housings holding a portion of the expansion card rearwardly of the connector therebetween, and

a first end plate attached to a first end of said housing and a second plate attached to second end of said housing.

8. The enclosure system of claim 7 , further comprising fins extending outwardly of said sub-housings for exchanging heat therefrom with the surrounding atmosphere.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2023
From: LOCKHEED MARTIN CORPORATION
To: AUSTRALIAN RAIL TRACK CORPORATION LIMITED
Reel/Frame 062841/0282 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2008
From: METZGER, THOMAS R.
To: LOCKHEED MARTIN CORP.
Reel/Frame 022008/0752 →
Continuity (2)
Provisional Application 60987177 · Nov 12, 2007
Related Publication 20090122500A1 · May 14, 2009