RFID transponder enclosure for harsh environments
A radio frequency identification device is enclosed in an enclosure suitable for harsh environments, and is resistant to physical, chemical, temperature, and electro-magnetic abuse. The enclosure includes a shell member configured to deflect direct blows to the transponder and can be shaped to fit various types of surfaces to which it can be affixed.
1. An RFID tag comprising:
a mounting member, comprising:
a shell member;
an extension positioned with the shell member and configured for attachment to a correspondingly configured surface;
an elastomeric member, positioned in the shell member; and
an RFID electronics assembly, positioned interior to the elastomeric member.
2. The RFID tag of claim 1 , the shell member comprising:
an opening formed through a surface of the shell member.
3. The RFID tag of claim 2 , wherein the elastomeric member when positioned in the shell member protrudes through the opening.
4. The RFID tag of claim 2 , wherein an edge of the shell member adjoining the opening is configured to improve bonding between the shell member and the elastomeric member.
5. The RFID tag of claim 1 , wherein the elastomeric member is bonded to the shell member.
6. The RFID tag of claim 1 , the elastomeric member comprising:
a substantially cylindrical cavity formed axially within the elastomeric member,
wherein the RFID electronics assembly is positioned in the cavity.
7. The RFID tag of claim 1 , wherein the RFID electronics assembly is bonded to the elastomeric member.
8. The RFID tag of claim 1 , wherein the elastomeric member is composed of an elastomeric material selected to absorb impact, resist chemical degradation, and avoid brittleness at temperatures below that of liquid nitrogen.
9. The RFID tag of claim 1 , wherein the elastomeric member is composed of an elastomeric material selected for resistance to ultraviolet radiation.
10. The RFID tag of claim 1 , further comprising:
a packing member, the RFID electronics assembly packed within the packing member,
wherein the packing member is selected for reduction of vibration transmission between the elastomeric member and the RFID electronics assembly, and for lack of crystallization at sustained high temperatures.
11. The RFID tag of claim 1 , the RFID electronics assembly comprising:
an EPROM configured to hold an identity for the RFID tag.
12. The RFID tag of claim 1 , the RFID electronics assembly comprising:
a laser etched circuit configured to hold an identity for the RFID tag.
13. A method of enclosing an RFID electronics assembly in an RFID tag, comprising:
embedding the RFID electronics assembly in an elastomeric member;
forming an impact-resistant shell in the RFID tag; and
bonding the elastomeric member to the shell.
14. The method of claim 13 , wherein the elastomeric member is composed of an elastomeric material selected to absorb impact, resist chemical degradation, and avoid brittleness at temperatures below that of liquid nitrogen.
15. The method of claim 13 , forming an impact-resistant shell comprising:
forming an opening in an attachment member; and
exerting pressure on the attachment member, thereby forming a protrusion in the attachment member, the protrusion including the opening.
16. The method of claim 13 , embedding the RFID electronics assembly in an elastomeric member comprising:
forming a cavity in the elastomeric member parallel to an axis of the elastomeric member;
positioning the RFID electronics assembly in cavity; and
bonding the RFID electronics assembly to the elastomeric member.
17. The method of claim 13 , further comprising:
forming an opening in the shell; and
positioning the elastomeric member in the shell,
wherein the elastomeric member protrudes through the opening when positioned in the shell.
18. The method of claim 13 , further comprising:
forming an opening in the shell,
wherein an edge of the shell adjacent to the opening forms an oblique angle relative to the elastomeric member when the elastomeric member is positioned in the shell.
19. The method of claim 13 , embedding the RFID electronics assembly in an elastomeric member comprising:
forming a first portion of the elastomeric member;
forming a second portion of the elastomeric member, configured to mate with the first portion;
positioning the RFID electronics assembly between the first portion and the second portion;
bonding the first portion to the second portion.
20. The method of claim 13 , embedding the RFID electronics assembly in an elastomeric member comprising:
holding the RFID electronics assembly in the elastomeric member with a clip.
21. The method of claim 13 , embedding the RFID electronics assembly in an elastomeric member comprising:
cushioning the RFID electronics assembly in the elastomeric member with a gel.
22. The method of claim 13 , embedding the RFID electronics assembly in an elastomeric member comprising:
equalizing a first pressure exterior to the elastomeric member and a second pressure interior to the elastomeric member.