IP Library › Granted Patent US 7,872,338
Granted Patent B2
US 7,872,338 · App. 12/266,789 · Granted Jan 18, 2011

Microelectromechanical device packages with integral heaters

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Quick Facts
Patent No.
US 7,872,338
App. No.
12/266,789
Granted
Jan 18, 2011
Kind
B2
Abstract

A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.

Claims (17)

1. A device package, comprising:

a package substrate having first substrate layer and second substrate layer;

a cover;

a glass frit proximate the cover and the second substrate layer; and

a heater laminated between the first and second substrate layers proximate the glass frit, the heater operable to fuse the glass frit to the cover and second substrate layer.

2. The package of claim 1 , wherein the first and second substrate layers are ceramic materials.

3. The package of claim 1 , further comprising:

a microelectromechanical system device attached to the package substrate.

4. The package of claim 1 , further comprising: an image detector or image sensor device attached to the package substrate.

5. The package of claim 1 , further comprising:

a CCD device attached to the package substrate.

6. The package of claim 3 , wherein the microelectromechanical system device is a micromirror array device having an array of deflectable reflective mirror plates.

7. The package of claim 6 , wherein the mirror plates are enclosed within a space between a device substrate that is transmissive to visible light and a semiconductor device substrate.

8. The package of claim 7 , wherein the semiconductor device substrate comprises an array of electrodes for deflecting the mirror plates.

9. The package of claim 6 , further comprising: a package cover substrate that is transmissive to visible light and is bonded to the package substrate such that the micromirror array device is enclosed within a space between the package cover and the package substrate.

10. The package of claim 1 , wherein the package cover substrate is hermetically bonded to the package substrate.

11. The package of claim 1 , further comprising: a spatial light modulator device attached to the package substrate.