Nozzle arrangement with sealing structure and thermal actuator
View Patent ↗A nozzle arrangement for an inkjet printer. the nozzle arrangement comprising a substrate assembly defining an inlet channel; a nozzle chamber wall and a roof wall collectively positioned on the substrate assembly to define a nozzle chamber in fluid communication with the inlet channel, the roof wall defining an ejection port in fluid communication with the nozzle chamber; a thermal actuator mounted to the substrate assembly and extending into the nozzle chamber to terminate in a free end, the thermal actuator comprising a pair of actuating members spaced apart to form a gap, one of the actuating members being connected to an electrical supply; a heat sink assembly positioned in the gap between the pair of actuating members; and a sealing structure provided between an end of the thermal actuator mounted to the substrate and an end of the thermal actuator terminating in the nozzle chamber, the sealing structure permitting movement of the thermal actuator therein and inhibiting fluid leakage from the nozzle chamber via surface tension.
1. A nozzle arrangement for an inkjet printer, the nozzle arrangement comprising:
a substrate assembly defining an inlet channel;
a nozzle chamber wall and a roof wall collectively positioned on the substrate assembly to define a nozzle chamber in fluid communication with the inlet channel, the roof wall defining an ejection port in fluid communication with the nozzle chamber;
a thermal actuator mounted to the substrate assembly and extending into the nozzle chamber to terminate in a free end, the thermal actuator comprising a pair of actuating members spaced apart to form a gap, one of the actuating members being connected to an electrical supply;
a heat sink assembly positioned in the gap between the pair of actuating members; and
a sealing structure provided between an end of the thermal actuator mounted to the substrate and an end of the thermal actuator terminating in the nozzle chamber, the sealing structure permitting movement of the thermal actuator therein and inhibiting fluid leakage from the nozzle chamber via surface tension.
2. A nozzle arrangement as claimed in claim 1 , wherein the heat sink assembly includes a pair of spaced apart heatsinks each extending between and making contact with the actuating members.
3. A nozzle arrangement as claimed in claim 1 , wherein the substrate assembly includes a substrate, and the electrical supply is in the form of one or more CMOS layers positioned on the substrate.
4. A nozzle arrangement as claimed in claim 1 , wherein the actuating members are of a resiliently flexible material.
5. The nozzle arrangement as claimed in claim 1 , wherein the sealing structure defines a fluid flow path connecting a side of the sealing structure adjacent to the nozzle chamber and a side of the sealing structure nearer to the mounting point of the thermal actuator.
6. The nozzle arrangement as claimed in claim 5 , wherein the thermal actuator extends through the fluid flow path.
7. The nozzle arrangement as claimed in claim 5 , wherein the fluid flow path is formed such that fluid flowing therethrough sets up a meniscus part way through the flow path, thereby substantially inhibiting the fluid from completely flowing therethrough.
8. The nozzle arrangement as claimed in claim 7 , further comprising a channel defined in the substrate assembly at a position substantially adjacent to an end of the fluid flow path.