Bonded printhead assembly

1. A bonded printhead assembly comprising:

at least one printhead integrated circuit having a plurality of etched ink supply channels defined in a first bonding surface thereof, each ink supply channel extending longitudinally along said first bonding surface;

a molded ink manifold having a second bonding surface; and

an adhesive tape sandwiched between the first bonding surface and the second bonding surface, said adhesive tape having a plurality of ink supply apertures defined therein,

wherein each ink supply channel is divided into sections by transverse silicon walls, and wherein said ink supply apertures are positioned to coincide with said silicon walls such that each aperture supplies ink to two of said sections.

2. The bonded printhead assembly of claim 1 , wherein the printhead integrated circuit has a thickness of less than 1000 microns.

3. The bonded printhead assembly of claim 1 , wherein the printhead integrated circuit has a thickness of less than about 250 microns.

4. The bonded printhead assembly of claim 1 , wherein the adhesive tape has a plurality of laser-drilled ink supply apertures defined therein to coincide with ink supply channel inlets defined in said first bonding surface.

5. The bonded printhead assembly of claim 1 , wherein said ink supply apertures and said ink supply channels have substantially the same width.

6. The bonded printhead assembly of claim 1 , wherein a plurality of said printhead integrated circuits are bonded to said molded ink manifold.

7. A pagewidth inkjet printhead assembly comprising the bonded printhead assembly of claim 6 .