Passive electronic network components designed for direct body fluid exposure
View Patent ↗An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.
1. An implantable passive electronic network component adapted for prolonged direct body fluid exposure, comprising:
a non-conductive body of biocompatible and non-migratable material;
at least one conductive electrode associated with the non-conductive body to form at least one of a capacitor, resistor or an inductor;
a first conductive termination surface of biocompatible and non-migratable material, fixed to a portion of the non-conductive body and conductively coupled to the at least one conductive electrode; and
a second conductive termination surface of biocompatible and non-migratable material, fixed to a portion of the non-conductive body in spaced relation to the first conductive termination surface, and conductively coupled to the at least one conductive electrode.
2. The passive electronic network component of claim 1 , wherein the first and second conductive termination surfaces comprise a noble metal or a noble metal composition.
3. The passive electronic network component of claim 1 , including a connection material comprising a non-migratable and biocompatible material conductively coupling the first and second conductive termination surfaces to at least one adjacent conductive network component.
4. The passive electronic network component of claim 3 , wherein the at least one adjacent conductive network component comprises a lead wire.
5. The passive electronic network component of claim 3 , wherein the connection material comprises a brazing, welding or soldering material selected from the group consisting of: titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co—Cr—Ni alloys, MP35N, stainless steel, gold Zrc, ZrN, TiN, NbO, TiC, TaC, Indium Oxide/Indium Tin Oxide (Transparent Conductive Oxides), gold-bearing glass frit, TiCuSil, CuSil, and gold-based braze.
6. The passive electronic network component of claim 3 , wherein the connection material comprises a conductive thermal-setting material, comprising a polymer selected from the group consisting of: epoxies, polyimides, polyethylene oxide, polyurethane, silicone, polyesters, polycarbonate, polyethylene, polyvinyl chloride, polypropylene, methylacrylate, para-xylylene, and polypyrrhol.
7. The passive electronic network component of claim 6 , wherein the thermal-setting material includes a non-migratable and biocompatible conductive filler selected from the group consisting of titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co—Cr—Ni alloys, MP35N, stainless steel, gold, ZrC, ZrN, TiN, NbO, TiC, TaC, Indium Oxide/Indium Tin Oxide (Transparent Conductive Oxides).
8. The passive electronic network component of claim 1 , wherein the passive electronic network component comprises a capacitor, and wherein the at least one conductive electrode comprises first and second sets of electrode plates embedded within the non-conductive body, each set of electrode plates being conductively coupled to a respective one of the first or second conductive termination surfaces.
9. The passive electronic network component of claim 8 , wherein the first and second sets of electrode plates comprise a noble metal or noble metal composition.
10. The passive electronic network component of claim 9 , wherein the first and second sets of electrode plates comprise gold, platinum, a gold-based alloy, or a platinum-based alloy.
11. The passive electronic network component of claim 1 , wherein the passive electronic network component comprises an inductor, and wherein the at least one conductive electrode comprises a circuit trace on a surface of the body which extends from the first conductive termination surface to the second conductive termination surface.
12. The passive electronic network component of claim 11 , wherein the circuit trace comprises a noble metal or a noble metal composition.
13. The passive electronic network component of claim 12 , wherein the circuit trace comprises gold, platinum, a gold-based alloy, or a platinum-based alloy.
14. The passive electronic network component of claim 1 , wherein the passive electronic network component comprises an inductor, and wherein the at least one conductive electrode comprises at least one circuit trace embedded within the body and extending from the first conductive termination surface to the second conductive termination surface.
15. The passive electronic network component of claim 14 , wherein the circuit trace comprises a noble metal or a noble metal composition.
16. The passive electronic network component of claim 15 , wherein the circuit trace comprises gold, platinum, a gold-based alloy, or a platinum-based alloy.
17. The passive electronic network component of claim 14 , wherein the passive electronic network component comprises a capacitor in parallel with the inductor, and wherein the at least one conductive electrode comprises first and second sets of electrode plates embedded within the non-conductive body, each set of electrode plates being conductively coupled to a respective one of the first or second conductive termination surfaces, the parallel inductor and capacitor forming a bandstop filter.
18. The passive electronic network component of claim 17 , wherein the first and second sets of electrode plates comprise a noble metal or noble metal composition.
19. The passive electronic network component of claim 18 , wherein the first and second sets of electrode plates comprise gold, platinum, a gold-based alloy, or a platinum-based alloy.
20. The passive electronic network component of claim 1 , wherein the passive electronic network component comprises a resistor, and wherein the at least one conductive electrode comprises a circuit trace on a surface of the non-conductive body which extends from the first conductive termination surface to the second conductive termination surface.
21. The passive electronic network component of claim 20 , wherein the circuit trace comprises a noble metal or a noble metal composition.
22. The passive electronic network component of claim 21 , wherein the circuit trace comprises gold, platinum, a gold-based alloy, or a platinum-based alloy.
23. The passive electronic network component of claim 1 , wherein the passive electronic network component comprises a resistor, and wherein the at least one conductive electrode comprises at least one circuit trace embedded within the non-conductive body and extending from the first conductive termination surface to the second conductive termination surface.
24. The passive electronic network component of claim 23 , wherein the circuit trace comprises a noble metal or a noble metal composition.
25. The passive electronic network component of claim 24 , wherein the circuit trace comprises gold, platinum, a gold-based alloy, or a platinum-based alloy.