Two-wavelength semiconductor laser device and its fabricating method

1. A two-wavelength semiconductor laser device comprising a first semiconductor laser device and a second semiconductor laser device each having a window structure in a vicinity of an optical resonator facet, on a first-conductivity type single crystal semiconductor substrate, wherein

the first semiconductor laser device includes at least a first-conductivity type first cladding layer, a first guide layer made of AlGaAs mixed crystal, a first quantum well active layer having a barrier layer made of AlGaAs mixed crystal, a second guide layer made of AlGaAs mixed crystal, and a second-conductivity type second cladding layer, sequentially formed on the semiconductor substrate,

the second semiconductor laser device includes at least a first-conductivity type third cladding layer, a third guide layer made of AlGaInP mixed crystal, a second quantum well active layer having a barrier layer made of AlGaInP mixed crystal, a fourth guide layer made of AlGaInP mixed crystal, and a second-conductivity type fourth cladding layer, sequentially formed on the semiconductor substrate,

at least the barrier layer included in the first quantum well active layer, the first guide layer, and the second guide layer each have an Al molar ratio of more than 0.47 and 0.60 or less,

a peak concentration of a first impurity in the first quantum well active layer in the window structure of the first semiconductor laser device is higher than a peak concentration of a second impurity in the second quantum well active layer in the window structure of the second semiconductor laser device,

the peak concentration of the second impurity is 1×10 18 /cm 3 or more and 1×10 19 /cm 3 or less,

a diffusion end closer to the semiconductor substrate of the first impurity in the window structure of the first semiconductor laser device is located in the first cladding layer,

a diffusion end closer to the semiconductor substrate of the second impurity in the window structure of the second semiconductor laser device is located in the third cladding layer, and

a distance from the first quantum well active layer to the diffusion end closer to the semiconductor substrate of the first impurity is smaller than a distance from the second quantum well active layer to the diffusion end closer to the semiconductor substrate of the second impurity.

2. The two-wavelength semiconductor laser device of claim 1 , wherein the barrier layer included in the first quantum well active layer, the first guide layer, and the second guide layer each have an Al molar ratio of 0.53 or more and 0.60 or less.

3. The two-wavelength semiconductor laser device of claim 1 , wherein the second cladding layer and the fourth cladding layer are each made of AlGaInP mixed crystal.

4. The two-wavelength semiconductor laser device of claim 1 , wherein the distance from the first quantum well active layer to the diffusion end closer to the semiconductor substrate of the first impurity is 0.8 μm or less.

5. The two-wavelength semiconductor laser device of claim 1 , wherein

a first peak wavelength of a spectrum obtained from the window region in the first semiconductor laser device by a photoluminescence technique or a cathode luminescence technique is 730 nm or less, and

a second peak wavelength of a spectrum obtained from the window region in the second semiconductor laser device by the photoluminescence technique or the cathode luminescence technique is 595 nm or less.

6. The two-wavelength semiconductor laser device of claim 5 , wherein the first peak wavelength is 710 nm or less.

7. The two-wavelength semiconductor laser device of claim 5 , wherein

the first semiconductor laser device has an oscillation wavelength of 760 nm or more and 790 nm or less, and

the second semiconductor laser device has an oscillation wavelength of 650 nm or more and 670 nm or less.

8. The two-wavelength semiconductor laser device of claim 1 , wherein the first semiconductor laser device and the second semiconductor laser device each have a light output of 200 mW or more during a CW operation.

9. The two-wavelength semiconductor laser device of claim 8 , wherein the first semiconductor laser device and the second semiconductor laser device each have a vertical divergence angle of 18° or less.

10. The two-wavelength semiconductor laser device of claim 9 , wherein the second guide layer has a film thickness of 10 nm or more and 43 nm or less.

11. The two-wavelength semiconductor laser device of claim 1 , wherein

the first quantum well active layer includes a well layer made of GaAs, and

the second quantum well active layer includes a well layer made of GaInP.

12. The two-wavelength semiconductor laser device of claim 11 , wherein a film thickness of the well layer of the first quantum well active layer is smaller than a film thickness of the barrier layer of the first quantum well active layer.

13. The two-wavelength semiconductor laser device of claim 11 , wherein the well layer of the first quantum well active layer has a film thickness of 4 nm or less.

14. The two-wavelength semiconductor laser device of claim 11 , wherein the well layer of the first quantum well active layer includes two layers.

15. The two-wavelength semiconductor laser device of claim 1 , wherein an Al molar ratio of the second cladding layer is larger than an Al molar ratio of the fourth cladding layer.

16. The two-wavelength semiconductor laser device of claim 1 , wherein

a lattice constant of the second cladding layer is smaller with respect to a lattice constant of the substrate, and

a lattice constant of the fourth cladding layer is larger than the lattice constant of the second cladding layer.

17. The two-wavelength semiconductor laser device of claim 1 , wherein

the second cladding layer and the fourth cladding layer each have a doping concentration of 1×10 17 /cm 3 or more and 1×10 18 /cm 3 or less, and

the doping concentration of the second cladding layer is smaller than the doping concentration of the fourth cladding layer.

18. The two-wavelength semiconductor laser device of claim 1 , wherein

the window structure of the first semiconductor laser device includes Zn or Si, and

the window structure of the second semiconductor laser device includes Zn.

19. A method for fabricating a two-wavelength semiconductor laser device comprising a first semiconductor laser device and a second semiconductor laser device each having a window structure in a vicinity of an optical resonator facet, on a first-conductivity type single crystal semiconductor substrate, the method comprising the steps of:

forming a first multilayer structure including at least a first-conductivity type first cladding layer, a first guide layer made of AlGaAs mixed crystal, a first quantum well active layer having a barrier layer made of AlGaAs mixed crystal, a second guide layer made of AlGaAs mixed crystal, and a second-conductivity type second cladding layer, sequentially stacked in a first region where the first semiconductor laser device is to be formed on the semiconductor substrate;

forming a second multilayer structure including at least a first-conductivity type third cladding layer, a third guide layer made of AlGaInP mixed crystal, a second quantum well active layer having a barrier layer made of AlGaInP mixed crystal, a fourth guide layer made of AlGaInP mixed crystal, and a second-conductivity type fourth cladding layer, sequentially stacked in a region where the second semiconductor laser device is to be formed on the semiconductor substrate, the second multilayer structure being spaced from the first multilayer structure; and

thermally diffusing a first impurity and a second impurity of the same species to form the window structure of the first semiconductor laser device in the first multilayer structure, the first impurity being diffused in the window structure of the first semiconductor laser device, and at the same time, form the window structure of the second semiconductor laser device in the second multilayer structure, the second impurity being diffused in the window structure of the second semiconductor laser device,

wherein a peak concentration of the first impurity in the first quantum well active layer in the window structure of the first semiconductor laser device is larger than a peak concentration of the second impurity in the second quantum well active layer in the window structure of the second semiconductor laser device,

the peak concentration of the second impurity is 1×10 18 /cm 3 or more and 1×10 19 /cm 3 or less, and

the thermal diffusion is performed for no longer than a time that allows a minimum peak wavelength of photoluminescence light in the window structure of the first semiconductor laser device.

20. A method for fabricating a two-wavelength semiconductor laser device comprising a first semiconductor laser device and a second semiconductor laser device each having a window structure in a vicinity of an optical resonator facet, on a first-conductivity type single crystal semiconductor substrate, the method comprising the steps of:

forming a first multilayer structure including at least a first-conductivity type first cladding layer, a first guide layer made of AlGaAs mixed crystal, a first quantum well active layer having a barrier layer made of AlGaAs mixed crystal, a second guide layer made of AlGaAs mixed crystal, and a second-conductivity type second cladding layer, sequentially stacked in a first region where the first semiconductor laser device is to be formed on the semiconductor substrate;

forming a second multilayer structure including at least a first-conductivity type third cladding layer, a third guide layer made of AlGaInP mixed crystal, a second quantum well active layer having a barrier layer made of AlGaInP mixed crystal, a fourth guide layer made of AlGaInP mixed crystal, and a second-conductivity type fourth cladding layer, sequentially stacked in a region where the second semiconductor laser device is to be formed on the semiconductor substrate, the second multilayer structure being spaced from the first multilayer structure;

ion-implanting a first impurity into at least the first quantum well active layer in the first multilayer structure; and

thermally diffusing a second impurity of a species different from that of the first impurity to form the window structure of the second semiconductor laser device in the second multilayer structure, the second impurity being diffused in the window structure of the second semiconductor laser device, and at the same time, forming the window structure of the first semiconductor laser device, the first impurity ion-implanted in the first multilayer structure being diffused in the window structure of the first semiconductor laser device,

wherein a peak concentration of the first impurity in the first quantum well active layer in the window structure of the first semiconductor laser device is larger than a peak concentration of the second impurity in the second quantum well active layer in the window structure of the second semiconductor laser device, and

the peak concentration of the second impurity is 1×10 18 /cm 3 or more and 1×10 19 /cm 3 or less.

21. The method of claim 20 , wherein

a diffusion end closer to the semiconductor substrate of the first impurity in the window structure of the first semiconductor laser device is located in the first cladding layer, and

a diffusion end closer to the semiconductor substrate of the second impurity in the window structure of the second semiconductor laser device is located in the third cladding layer.

22. The method of claim 20 , wherein the thermal diffusion is performed for no longer than a time that allows a minimum peak wavelength of photoluminescence light in the window structure of the first semiconductor laser device.

23. The method of claim 20 , wherein

the first impurity is Si, and

the second impurity is Zn.