IP Library Granted Patent US 7,852,672
Granted Patent B2
US 7,852,672 · App. 12/271,647 · Granted Dec 14, 2010

Integrated circuit embedded with non-volatile programmable memory having variable coupling

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Quick Facts
Patent No.
US 7,852,672
App. No.
12/271,647
Granted
Dec 14, 2010
Kind
B2
Abstract

A programmable non-volatile device uses a floating gate that functions as a FET gate that overlaps a variable portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. Multi-state embodiments are also possible. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.

Claims (33)

1. A programmable non-volatile device situated on a substrate comprising:

a floating gate;

wherein said floating gate is comprised of a material that is also used as a gate for a transistor device also situated on the substrate and associated with a logic gate and/or a volatile memory;

a source region; and

a drain region comprised of a first drain region and at least one separate second drain region; and

wherein the drain region overlaps a sufficient portion of said floating gate such that a programming voltage for the device applied to said drain can be imparted to said floating gate through capacitive coupling;

further wherein the device is adapted so that different ones of said first drain region and said second drain region can be coupled to said gate during program and read operations respectively.

2. The programmable device of claim 1 wherein the device is n-channel.

3. The programmable device of claim 1 wherein the device is p-channel.

4. The programmable device of claim 1 wherein the device is adapted such that either, none or both said first drain region and said second region can be biased during a program operation, and only one of said first region and said second region are biased during a read operation.

5. The programmable device of claim 1 wherein the device is adapted such that either, none or both said first drain region and said second region can be biased during a program operation, and either or both of said first region and said second region are biased during an erase operation.

6. The programmable device of claim 1 wherein the device is adapted such that either, none or both said first drain region and said second region can be biased during a program operation, and either or both of said first region and said second region are biased during a read operation.

7. The programmable device of claim 1 wherein the device is adapted such that at least one of a program operation, a read operation, and/or an erase operation can be varied in time by changing a coupling of said first drain region and said second region to said gate.

8. The programmable device of claim 1 wherein said floating gate can be erased.

9. The programmable device of claim 8 wherein said device can be re-programmed.

10. The programmable device of claim 8 wherein said floating gate is eraseable by an erase voltage applied to said source region.

11. The programmable device of claim 1 wherein said device is part of a programmable array embedded with separate logic circuits and/or memory circuits in an integrated circuit.

12. The programmable device of claim 11 wherein said device is associated with one of the following: a data encryption circuit; a reference trimming circuit; a manufacturing ID; and/or a security ID.

13. The programmable device of claim 1 , wherein said capacitive coupling takes place in a first trench situated in the substrate.

14. The programmable device of claim 13 , wherein a set of second trenches in said substrate are used as embedded DRAM.

15. The programmable device of claim 1 , further including a second programmable device coupled in a paired latch arrangement such a datum and its compliment are stored in said paired latch.

16. The programmable device of claim 1 , wherein the device is adapted to be read by a bias voltage applied to one of said first drain region and/or said at least one separate second drain region which is adjusted with time to determine a threshold voltage of said floating gate.

17. The programmable device of claim 1 , wherein said floating gate is a multi-level structure.

18. The programmable device of claim 1 , wherein said device is part of a thin film transistor.

19. The programmable device of claim 1 , wherein said floating gate is oriented in a non-planar configuration.

20. The programmable device of claim 1 , wherein said floating gate is distributed and includes impurities acting as charge storage sites.

21. A one-time programmable (OTP) device situated on a substrate comprising:

a floating gate;

wherein said floating gate is comprised of a material that is also shared by an interconnect and/or another gate for a transistor device also situated on the substrate and associated with a logic gate and/or a volatile memory;

a source region; and

a drain region overlapping a portion of said floating gate, and said drain region including at least a first drain region and a second selectable drain region;

wherein a variable capacitive coupling between said drain region and said floating gate can be effectuated by one or more selection signals applied to said first drain region and said second drain region respectively;

wherein said variable capacitive coupling causes a variable amount of channel hot electrons from said first drain region and from said second drain region to permanently alter a threshold value of said floating gate and store data in the OTP device.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
CHANGE OF NAME Recorded Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2011
From: JONKER LLC
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 026133/0894 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2009
From: LIU, DAVID KUAN-YU; GROSS, JOHN NICHOLAS
To: JONKER LLC
Reel/Frame 023485/0986 →