Pagewidth printhead assembly having air channels for purging unnecessary ink

1. A pagewidth printhead assembly that comprises

a support structure;

a plurality of printhead modules arranged on the support structure, each printhead module comprising:

a printhead integrated circuit (IC) having a plurality of ink ejection nozzles;

an ink distribution assembly formed from a stack of ink distribution layers, each layer defining apertures therein at predetermined locations, the layers laminated together so that the apertures of each layer complementarily define discrete ink distribution channels, the printhead IC being mounted on the ink distribution assembly such that the nozzles are in fluid communication with the ink distribution channels; and

the ink distribution assembly defining air channels for directing air at the nozzles of the IC to purge unnecessary ink from said nozzles.

2. The pagewidth printhead assembly of claim 1 , wherein the IC includes a plurality of micro-electromechanical nozzles which are spaced so as to be capable of printing with a resolution of up to 1600 dots per inch, said IC also configured to eject six different inks.

3. The pagewidth printhead assembly of claim 1 , wherein the ink distribution assembly includes a top layer sheet, an upper layer sheet, a mid layer sheet and a lower sheet.

4. The pagewidth printhead assembly of claim 3 , wherein the upper layer sheet is manufactured from stainless steel with the printhead IC bonded thereto.

5. The pagewidth printhead assembly of claim 1 , a tape automated bonding (TAB) film connected to the printhead IC for arranging said IC in signal communication with a controller of the printhead assembly.

6. The pagewidth printhead assembly of claim 4 , wherein the top layer sheet is configured to direct air at a side of the printhead IC mounted on the upper layer sheet.

7. The pagewidth printhead assembly of claim 4 , wherein the IC is bonded by wires onto the PCB film and these wires are then encapsulated in an epoxy.