IP Library Granted Patent US 7,990,628
Granted Patent B1
US 7,990,628 · App. 12/273,830 · Granted Aug 2, 2011

Planar flexure system with high pitch stiffness

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Quick Facts
Patent No.
US 7,990,628
App. No.
12/273,830
Granted
Aug 2, 2011
Kind
B1
Abstract

A flexure system for miniature camera and the like is disclosed. The flexure system can include a frame and a stage that is configured to move with respect to the frame. One or more flexures can interconnect the frame and the stage. Each flexure can have one or more film hinges formed thereon. The film hinges can be widely spaced and/or extended in length so as to substantially mitigate undesirable pitching of the stage.

Claims (23)

1. A flexure system for a miniature camera, the flexure system comprising:

a frame;

a stage;

an interconnecting member;

a first film hinge connecting between the frame and a proximal end of the interconnecting member; and

a second film hinge interconnecting between the stage and a distal end of the interconnecting member, wherein the flexure system is formed from a planar wafer having a first thickness such that the frame, the stage, and the interconnecting member are planar and have the first thickness and the first and second film hinges have a second thickness that is less than the first thickness.

2. The flexure system as recited in claim 1 , further comprising a linearizing flexure through which the first film hinge connects to the frame.

3. The flexure system as recited in claim 1 , wherein the first film hinge comprises two first film hinges and the two first film hinges are separated by a distance that is sufficient so as to substantially inhibit pitching of the stage.

4. The flexure system as recited in claim 1 , wherein the second film hinge comprises two second film hinges and the two second film hinges are separated by a distance that is sufficient so as to substantially inhibit pitching of the stage.

5. The flexure system as recited in claim 3 , wherein the two first film hinges are separated by a distance that is greater than one half of a diameter of the stage.

6. The flexure system as recited in claim 4 , wherein the two second film hinges are separated by a distance that is approximately equal to a diameter of the stage.

7. The flexure system as recited in claim 1 , wherein each of the first and second film hinges have a length that is sufficient so as to substantially inhibit pitching of the stage.

8. The flexure system as recited in claim 1 , wherein the frame is generally square.

9. The flexure system as recited in claim 1 , wherein the stage defines a lens mount.

10. The flexure system as recited in claim 1 , wherein the stage defines a lens mount that is disposed generally centrally within the frame.

11. The flexure system as recited in claim 1 , wherein the stage is generally co-planar with respect to the frame.

12. The flexure system as recited in claim 1 , wherein the frame is substantially rigid.

13. The flexure system as recited in claim 1 , wherein the interconnecting member is substantially rigid.

14. The flexure system as recited in claim 1 , wherein the stage is substantially rigid.

15. The flexure system as recited in claim 1 , wherein a spring rate for actuation of the stage in the orthogonal direction is approximately 15 N/m and a spring rate for in-plane movement is approximately 70,000 N/m.

16. The flexure system as recited in claim 1 , wherein the interconnecting member comprises four interconnecting members.

17. The flexure system as recited in claim 1 , wherein the interconnecting member extends radially from the frame to the stage.

18. The flexure system as recited in claim 1 , wherein the wafer is a silicon wafer.

Assignments (9)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
CHANGE OF NAME Recorded Aug 23, 2011
From: TESSERA MEMS TECHNOLOGIES, INC.
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 026794/0897 →
CHANGE OF NAME Recorded Sep 24, 2010
From: SIIMPEL CORPORATION
To: TESSERA MEMS TECHNOLOGIES, INC.
Reel/Frame 025042/0328 →
RELEASE OF SECURITY INTEREST Recorded May 7, 2010
From: SCALE VENTURE PARTNERS II, L.P.
To: SIIMPEL CORPORATION
Reel/Frame 024351/0353 →
PATENT SECURITY AGREEMENT Recorded Mar 31, 2010
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P.
Reel/Frame 024170/0078 →
PATENT SECURITY AGREEMENT Recorded Nov 16, 2009
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P., AS COLLATERAL AGENT
Reel/Frame 023519/0715 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2008
From: CALVET, ROBERT; LIU, XIAOLEI; JAIN, ANKUR
To: SIIMPEL CORPORATION
Reel/Frame 021860/0515 →