Nozzle device with expansive chamber-defining layer
View Patent ↗A nozzle device is provided for an inkjet printhead. The nozzle device includes a substrate assembly defining an ink supply. A chamber-defining layer defines a nozzle chamber in fluid communication with a nozzle opening and the ink supply. An actuating arm is coupled to the substrate assembly and terminates in a paddle separating the ink supply and the nozzle chamber. The arm includes a thermal bend portion proximal to the substrate assembly, and is configured to bend during actuation so that the paddle moves and causes ink within the nozzle chamber to be ejected out through the nozzle opening.
1. A nozzle device for an inkjet printhead, the nozzle device comprising:
a substrate assembly defining an ink supply;
a chamber-defining layer defining a nozzle chamber in fluid communication with a nozzle opening and the ink supply; and
an actuating arm coupled to the substrate assembly and terminating in a paddle separating the ink supply and nozzle chamber, the arm including a thermal bend portion proximal to the substrate assembly and configured to bend during actuation so that the paddle moves and causes ink within the nozzle chamber to be ejected out through the nozzle opening, wherein the
actuating arm further includes a bridge between the paddle and the thermal bend portion which supports a portion of the chamber-defining layer.
2. A nozzle device as claimed in claim 1 , wherein an active portion of the thermal bend portion is connected electrically to a current source within the substrate assembly.
3. A nozzle device as claimed in claim 2 , wherein the electrical connection is made to end terminals of the actuating arm, and the current source is configured to apply pulsed excitation drive voltage to said terminals.
4. A nozzle device as claimed in claim 2 , wherein a passive portion of the thermal bend portion is mechanically coupled to but electrically isolated from the active portion by posts with no current-induced heating occurring within the passive portion, the active portion being located between the passive portion and the substrate assembly.