IP Library Granted Patent US 8,059,270
Granted Patent B2
US 8,059,270 · App. 12/276,685 · Granted Nov 15, 2011

Microchip

Assignee: Rohm Co., Ltd.
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Quick Facts
Patent No.
US 8,059,270
App. No.
12/276,685
Granted
Nov 15, 2011
Kind
B2
Abstract

There is provided a microchip that is formed of a first substrate having a surface with a groove and a second substrate joined together and has a fluid circuit in the form of a cavity defined by the groove and a surface of the second substrate closer to the first substrate. The fluid circuit at least includes a detection portion having an optical path for transmitting light. The microchip includes at least one of a step defined by a groove formed in contact with at least one side surface of a groove of the first substrate that defines the optical path and a recess provided in the second substrate at a position opposite to the step.

Claims (10)

1. A microchip formed of a first substrate having a surface with a groove and a second substrate joined together, and having a fluid circuit in a form of a cavity defined by said groove and a surface of said second substrate closer to said first substrate, said fluid circuit including a detection portion having an optical path for transmitting light, the optical path comprising a portion of the groove, said microchip comprising at least one of a step or a recess, wherein the step is adjacent a side surface of the portion of the groove that defines said optical path, the step having a height that is less than a height of the portion of the groove that defines the optical path, the recess being in said second substrate at a position opposite the side surface of the portion of the groove that defines the optical path.

2. The microchip according to claim 1 , wherein said first substrate has at least has two steps each of which is adjacent a different side surface of the portion of said groove defining said optical path.

3. The microchip according to claim 2 , wherein the side surfaces of the portion of said groove defining said optical path are, respectively, a plane of incidence of said light and a plane of emission of said light.

4. The microchip according to claim 1 , wherein said first substrate has said step and said second substrate does not have said recess.

5. The microchip according to claim 1 , wherein the portion of said groove defining said optical path has a depth of at least 1 mm and at most 2 mm.

6. The microchip according to claim 1 , wherein a portion of said groove defining said step has a depth of at most 0.5 mm.

7. The microchip according to claim 1 , wherein a portion of said groove defining said step has a depth of at most 0.1 mm.

8. The microchip according to claim 1 , wherein said first substrate is a transparent substrate.

9. The microchip according to claim 1 , wherein said second substrate is an opaque substrate.

10. The microchip according to claim 9 , wherein said second substrate is a black substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2019
From: ROHM CO., LTD.
To: HORIBA, LTD.
Reel/Frame 049049/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2008
From: KAGEYAMA, YASUHISA; MORI, TOSHIHIRO
To: ROHM CO., LTD.
Reel/Frame 021903/0100 →
Priority Claims (1)
JP 2007-304509 · Nov 26, 2007 · national
Continuity (1)
Related Publication 20090135407A1 · May 28, 2009