Method of manufacturing an electronic part mounting structure

1. A method for manufacturing an electronic part mounting structure, comprising:

forming a protruding electrode made of a conductive resin including a photosensitive resin and a conductive filler on an electrode terminal of an electronic part or on a connection terminal of a substrate;

positioning the electronic part or the substrate on which the protruding electrode is formed so that the electrode terminal and the connection terminal face each other with the protruding electrode interposed therebetween; and

connecting the electrode terminal and the connection terminal with the protruding electrode interposed therebetween by pressing the electronic part,

wherein the forming of the protruding electrode comprises:

supplying a liquid resin including a photosensitive resin and a conductive filler to a container through which at least light transmits a bottom thereof;

immersing an electronic part where a plurality of electrode terminals are formed on one surface into the liquid resin in such a direction that the electrode terminal faces the bottom and has a predetermined distance relative to the bottom;

forming a first layer collectively on top of a plurality of the electrode terminals by curing the liquid resin on the electrode terminal through selective irradiation with light via a first opening of a photo mask from the bottom of the container;

pulling the electronic part up from the bottom by a predetermined distance;

forming a second layer on the first layer by curing the liquid resin on the first layer through selective irradiation with light using a photo mask having a second opening which is smaller than the first opening; and

forming the protruding electrode having a layer structure by repeating the pulling of the electronic part and the forming of the second layer sequentially.

2. The method for manufacturing an electronic part mounting structure according to claim 1 , wherein the bottom is made of the photo mask.

3. The method for manufacturing an electronic part mounting structure according to claim 1 , wherein the forming of the protruding electrode comprises:

supplying a liquid resin including a photosensitive resin and a conductive filler to a container;

immersing an electronic part where a plurality of electrode terminals are formed on one surface into the liquid resin in such a manner that the electrode terminal has a predetermined distance relative to the surface of the liquid resin;

forming a first layer collectively on a plurality of the electrode terminals by curing the liquid resin on the electrode terminal through selective irradiation with light via the first opening of a photo mask from the surface of the liquid resin;

lowering the electronic part down into the liquid resin by a predetermined distance;

forming a second layer on the first layer by curing the liquid resin on the first layer through selective irradiation with light using a photo mask having the second opening which is smaller than the first opening; and

forming the protruding electrode having a layer structure by repeating the lowering of the electronic part and the forming the second layer sequentially.

4. The method for manufacturing an electronic part mounting structure according to claim 1 , wherein the forming of the electrode comprises:

supplying the liquid resin including the photosensitive resin and the conductive filler onto the electronic part on which the electrode terminal is formed in a thickness corresponding to the thickness of the protruding electrode; and growing the protruding electrode by curing the liquid resin on the electrode terminal through selective irradiation of the liquid resin with light via an opening of a photo mask while the intensity of light is gradually increased.