Light emitting diode module
View Patent ↗The present invention relates to a light emitting diode (LED) module ( 10 ), comprising at least one LED chip ( 12 ) having a surface ( 13 ) for emitting light, and a ceramic conversion plate ( 14 ). The LED module is characterized in that the ceramic conversion plate includes a first segment ( 18 ) covering a first portion of the light emitting surface of the LED chip(s) and a second segment ( 20 ) provided alongside the first segment covering a second portion of the light emitting surface of the LED chip(s), wherein at least one of the segments comprises a wavelength-converting material for converting light emitted from the LED chip(s) to a certain wavelength. The present invention also relates to a method for the manufacturing of such an LED module, and a ceramic conversion plate for use in an LED module.
1. Light emitting diode (LED) module, comprising:
at least one LED chip having a surface for emitting light, and
a ceramic conversion plate,
characterized in that the ceramic conversion plate includes a first segment covering a first portion of the light emitting surface of the LED chip(s) and a second segment provided alongside the first segment covering a second portion of the light emitting surface of the LED chip(s), wherein at least one of the segments comprises a wavelength-converting material for converting light emitted from the LED chip(s) to a certain wavelength.
2. An LED module according to claim 1 , wherein the first segment comprises a first wavelength-converting material for converting light emitted from the LED chip(s) to a first wavelength and the second segment comprises a second wavelength-converting material for converting light emitted from the LED chip(s) to a second wavelength.
3. An LED module according to claim 2 , wherein the ceramic conversion plate further includes a third segment provided alongside the first and/or second segments covering a third portion of the light emitting surface of the LED chip(s), and wherein the third segment comprises a third wavelength-converting material for converting light emitted from the LED chip(s) to a third wavelength, or a non wavelength-converting material.
4. An LED module according to claim 1 , wherein the first segment comprises a first wavelength-converting material for converting light emitted from the LED chip(s) to a first wavelength and the second segment comprises a non wavelength-converting material.
5. An LED module according to claim 1 , wherein at least one of the lateral positions of the conversion plate in relation to the LED chip(s) and the size of the segments is selected so that the LED module produces mixed light of a certain desired color.
6. A ceramic conversion plate for use in a light emitting diode (LED) module comprising at least one LED chip having a surface for emitting light, the ceramic conversion plate including:
a first segment adapted to cover a first portion of the light emitting surface of the LED chip(s), and
a second segment provided alongside the first segment and adapted to cover a second portion of the light emitting surface of the LED chip(s), wherein at least one of the segments comprises a wavelength-converting material for converting light emitted from the LED chip(s) to a certain wavelength.
7. A ceramic conversion plate to claim 6 , further including a third segment provided alongside the first and/or second segments and adapted to cover a third portion of the light emitting surface of the LED chip(s), wherein the third segment comprises a third wavelength-converting material for converting light emitted from the LED chip(s) to a third wavelength, or a non wavelength-converting material.