IP Library Granted Patent US 8,055,315
Granted Patent B2
US 8,055,315 · App. 12/281,370 · Granted Nov 8, 2011

Dustproof structure for slide type electronic device and slide type electronic device

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Quick Facts
Patent No.
US 8,055,315
App. No.
12/281,370
Granted
Nov 8, 2011
Kind
B2
Abstract

There are a first packing 31 and a second packing 32 for covering and sealing a first opening portion 11 a and a second opening portion 12 a other than a groove portion 31 a and a groove portion 32 a for leading an FPC 20 . The first packing 31 and the second packing 32 wipe surfaces of the FPC 20 coming in and going out of the groove portion 31 a and the groove portion 32 a by sliding operation of a second frame 12.

Claims (33)

1. A dustproof structure for a slidable wireless mobile station having:

a first frame including a first electronic component therein,

a second frame including a second electronic component therein,

the second frame being mounted on the first frame so as to be slidable relative to the first frame,

and wiring extending through an opening portion formed in at least one of opposing surfaces of the first frame and the second frame and electrically connecting the first electronic component and the second electronic component to each other,

the dustproof structure comprising:

a packing covering and sealing the opening portion other than a groove portion,

the groove portion being formed on the packing and leading the wiring via the opening portion;

wherein the packing is formed of silicon rubber or plastic plate;

the groove portion of the packing continuously contacts with a surface of the wiring; and

the packing wipes the surface of the wiring coming in and going out of the groove portion by sliding operation of the second frame.

2. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the packing is formed of a material having a low coefficient of friction.

3. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the packing has flexibility.

4. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the packing has a curtain portion in which a plurality of segments terminating at the groove portion are arranged.

5. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the wiring comprises a flexible board.

6. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the second frame is mounted on the first frame so as to be pivotably slidable relative to the first frame.

7. A slidable wireless mobile station comprising:

a first frame including a first electronic component therein,

a second frame including a second electronic component therein,

the second frame being mounted on the first frame so as to be slidable relative to the first frame,

wiring extending through an opening portion formed in at least one of opposing surfaces of the first frame and the second frame and electrically connecting the first electronic component and the second electronic component to each other, and

a dustproof structure comprising:

a packing covering and sealing the opening portion other than a groove portion,

the groove portion being formed on the packing and leading the wiring via the opening portion,

wherein:

the packing is formed of silicon rubber or plastic plate;

the groove portion of the packing continuously contacts with a surface of the wiring; and

the packing wipes the surface of the wiring coming in and going out of the groove portion by sliding operation of the second frame.

8. The dustproof structure for a slidable wireless mobile station according to claim 1 , wherein the opening portion includes a first opening portion and a second opening portion formed in opposing surfaces of the first frame and the second frame;

the wiring extends through the first opening portion and the second opening portion and electrically connects the first electronic component and the second electronic component to each other;

the packing includes first and second packings covering and sealing the first and the second opening portions other than groove portions, the groove portions being formed on the first and the second packings and leading the wiring via the first and the second opening portions, respectively;

the groove portions of the first and the second packings continuously contact with a surface of the wiring, respectively;

the first and the second packings wipe the surface of the wiring coming in and going out of the groove portions by sliding operation of the second frame, respectively.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2014
From: NEC CORPORATION
To: LENOVO INNOVATIONS LIMITED (HONG KONG)
Reel/Frame 033720/0767 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2008
From: KOMIYAMA, TAKEHIKO
To: NEC CORPORATION
Reel/Frame 021467/0871 →