Power semiconductor package
View Patent ↗A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
1. A semiconductor package comprising:
a semiconductor die that includes a bidirectional power device having at least a first power electrode and a second power electrode over a top surface of said semiconductor die, each power electrode including a plurality of spaced power fingers originating from each respective power electrode;
a first conductive clip over said top surface of said semiconductor die and electrically and mechanically coupled to said first power electrode, said first conductive clip including a first plurality of spaced fingers; and
a second conductive clip electrically and mechanically coupled to said second power electrode, said second conductive clip including a second plurality of spaced fingers arranged in an interdigited pattern with said first plurality of spaced fingers.
2. The semiconductor package of claim 1 , further comprising a passivation body encapsulating said semiconductor die.
3. The semiconductor package of claim 1 , wherein said semiconductor die is comprised of a III-nitride semiconductor.
4. The semiconductor package of claim 3 , wherein said III-nitride semiconductor is an alloy of InAlGaN.
5. The semiconductor package of claim 1 , wherein said power fingers are arranged in an interdigited pattern.
6. The semiconductor package of claim 1 , further comprising a control electrode, and a first conductive control clip electrically and mechanically coupled to said control electrode.
7. The semiconductor package of claim 6 , further comprising a current sense electrode, and a current sense clip electrically and mechanically coupled to said current sense electrode.
8. The semiconductor package of claim 1 , wherein said semiconductor die includes a first control electrode, and a first conductive control clip electrically and mechanically coupled to said first control electrode; and a second control electrode, and a second conductive control clip electrically and mechanically coupled to said second control electrode.
9. The semiconductor package of claim 8 , further comprising at least one current sense electrode, and a current sense clip electrically and mechanically connected to said current sense electrode.
10. The semiconductor package of claim 1 , wherein said first and said second conductive clips are electrically and mechanically connected to said first and said second power electrodes by a conductive adhesive.
11. The semiconductor package of claim 10 , wherein said conductive adhesive is either a solder or a conductive polymer.
12. The semiconductor package of claim 11 , wherein said conductive adhesive is comprised of a gold/tin solder.
13. The semiconductor package of claim 2 , wherein said passivation body is comprised of a polymer.
14. The semiconductor package of claim 13 , wherein said polymer comprises polysiloxane.