IP Library Granted Patent US 7,969,537
Granted Patent B2
US 7,969,537 · App. 12/284,365 · Granted Jun 28, 2011

Liquid crystal panel with static electricity damage prevention

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Quick Facts
Patent No.
US 7,969,537
App. No.
12/284,365
Granted
Jun 28, 2011
Kind
B2
Abstract

An exemplary liquid crystal panel includes a top substrate and a bottom substrate, a liquid crystal layer positioned between the top substrate and the bottom substrate, and a black matrix unit formed on a bottom surface that is adjacent to the liquid crystal layer of the top substrate. The black matrix includes an insulating layer and a grounded conductive layer between the bottom surface of the top substrate and the insulating layer.

Claims (37)

1. A liquid crystal panel comprising:

a top substrate and a bottom substrate;

a liquid crystal layer positioned between the top substrate and the bottom substrate;

a sealant adhering the top substrate and the bottom substrate so as to define a housing between the top substrate and the bottom substrate;

a black matrix unit formed on a bottom surface that is adjacent to the liquid crystal layer of the top substrate; and

a driving chip and a ground wire formed on a top surface that is adjacent to the liquid crystal layer of the bottom substrate, respectively, wherein the driving chip and the ground wire are outside the housing;

wherein the black matrix unit comprises an insulating layer and a grounded conductive layer between the bottom surface of the top substrate and the insulating layer.

2. The liquid crystal panel of claim 1 , further comprising a common electrode covering the black matrix unit, wherein the common electrode is in direct contact with the liquid crystal layer.

3. The liquid crystal panel of claim 2 , wherein the insulating layer is positioned between the conductive layer and the common electrode.

4. The liquid crystal panel of claim 1 , wherein the ground wire surrounds the housing and the driving chip.

5. The liquid crystal panel of claim 1 , further comprising a conductive block arranged at a peripheral corner of the bottom substrate, wherein the conductive block is electrically connected to the ground wire.

6. The liquid crystal panel of claim 5 , wherein the conductive block comprises one end electrically connected to the ground wire, and another end penetrating the insulating layer and directly abutting the conductive layer of the black matrix unit.

7. The liquid crystal panel of claim 1 , further comprising a plurality of grounded conductive side walls surrounding the driving chip and the sealant.

8. A liquid crystal panel comprising:

a top substrate and a bottom substrate;

a liquid crystal layer positioned between the top substrate and the bottom substrate;

a sealant adhering the top substrate and the bottom substrate so as to define a housing between the top substrate and the bottom substrate;

a black matrix unit formed on a bottom surface that is adjacent to the liquid crystal layer of the top substrate;

a common electrode covering the black matrix unit; and

a driving chip and a ground wire formed on a top surface that is adjacent to the liquid crystal layer of the bottom substrate, respectively, wherein the driving chip and the ground wire are outside the housing;

wherein the black matrix unit comprises a conductive layer and an insulating layer positioned between the conductive layer and the common electrode, and the conductive layer is adjacent to the top substrate, and defines a static electricity shield around the common electrode.

9. The liquid crystal panel of claim 8 , wherein the ground wire surrounds the housing and the driving chip.

10. The liquid crystal panel of claim 8 , further comprising a conductive block arranged at a peripheral corner of the bottom substrate, wherein the conductive block is electrically connected to the ground wire.

11. The liquid crystal panel of claim 10 , wherein the conductive block comprises one end electrically connected to the ground wire, and another end penetrating the insulating layer and directly abutting the conductive layer of the black matrix unit.

12. The liquid crystal panel of claim 8 , further comprising a plurality of grounded conductive side walls surrounding the driving chip and the sealant.

13. A liquid crystal panel comprising:

a top substrate and a bottom substrate;

a liquid crystal layer positioned between the top substrate and the bottom substrate;

a sealant adhering the top substrate and the bottom substrate so as to define a housing between the top substrate and the bottom substrate;

a black matrix unit formed on a bottom surface of the top substrate, the bottom surface adjacent to the liquid crystal layer;

a common electrode covering the black matrix unit; and

a driving chip and a ground wire respectively formed on a top surface of the bottom substrate, the top surface adjacent to the liquid crystal layer, wherein the driving chip and the ground wire are outside the housing;

wherein the black matrix unit comprises a conductive layer adjacent to the top substrate and an insulating layer positioned between the conductive layer and the common electrode, the conductive layer defines a static electricity shield around the common electrode, and the conductive layer is grounded to maintain a zero electric potential.

14. The liquid crystal panel of claim 13 , further comprising a conductive block arranged at a peripheral corner of the bottom substrate.

15. The liquid crystal panel of claim 14 , wherein the conductive block comprises one end electrically connected to the ground wire, and another end penetrating the insulating layer and directly abutting the conductive layer of the black matrix unit.

16. The liquid crystal panel of claim 13 , further comprising a plurality of grounded conductive side walls surrounding the driving chip and the sealant, wherein the conductive side walls are directly grounded via an external circuit to maintain a zero electric potential.

17. The liquid crystal panel of claim 13 , further comprising a plurality of grounded conductive side walls surrounding the driving chip and the sealant, wherein the conductive side walls are indirectly grounded via an external circuit to maintain a zero electric potential.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2024
From: INNOLUX CORPORATION
To: RED OAK INNOVATIONS LIMITED
Reel/Frame 069206/0903 →
CHANGE OF NAME Recorded Apr 7, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032621/0718 →
CHANGE OF NAME Recorded May 12, 2011
From: INNOLUX DISPLAY CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 026265/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2008
From: PAN, ZI-SHENG
To: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.; INNOLUX DISPLAY CORP.
Reel/Frame 022008/0638 →