Epoxy resins with improved burn properties
View Patent ↗Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes from 15 to 35 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 5 to 25 weight percent of a curative agent.
1. In an epoxy resin composition comprising one or more epoxy resins, polyetherimide and a curing agent, said epoxy resin composition being curable to form a cured resin which, when on fire, is able to self-extinguish once the source of heat and/or flame is removed from said cured resin, wherein the improvement comprises incorporating a sufficient amount of polyamideimide into said epoxy resin composition to reduce the time it takes said cured resin to self-extinguish.
2. The improved epoxy resin composition according to claim 1 wherein the weight ratio of polyetherimide to polyamideimide is from 5:1 to 1:5.
3. The improved epoxy resin composition according to claim 1 wherein the weight ratio of polyetherimide to polyamideimide is from 3:1 to 1:3.
4. The improved epoxy resin composition according to claim 1 wherein said curative agent is selected from the group consisting of 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone and dicyandiamide.
5. The improved epoxy resin composition according to claim 1 wherein said curative agent consists essentially of a combination of 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone and dicyandiamide.
6. A cured resin comprising the improved epoxy resin composition according to claim 1 that has been cured to form said cured resin.
7. The improved epoxy resin composition according to claim 1 that further comprises a fibrous reinforcement.
8. A cured product comprising the improved epoxy resin composition according to claim 7 that has been cured to form said cured product.
9. In method for making an epoxy resin composition wherein one or more epoxy resins are mixed together with polyetherimide and a curing agent, said epoxy resin composition being curable to form a cured resin which, when on fire, is able to self-extinguish once the source of heat and/or flame is removed from said cured resin, the improvement comprising incorporating a sufficient amount of polyamideimide into said epoxy resin composition to reduce the time it takes said cured resin to self-extinguish.
10. The improved method for making an epoxy resin composition according to claim 9 wherein the weight ratio of polyetherimide to polyamideimide is from 5:1 to 1:5.
11. The improved method for making an epoxy resin composition according to claim 9 wherein the weight ratio of polyetherimide to polyamideimide is from 3:1 to 1:3.
12. The improved method for making an epoxy resin composition according to claim 9 wherein said curative agent is selected from the group consisting of 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone and dicyandiamide.
13. The improved method for making an epoxy resin composition according to claim 9 wherein said curative agent consists essentially of a combination of 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone and dicyandiamide.
14. The improved method for making an epoxy resin composition according to claim 9 which includes the additional step of curing said epoxy resin composition to form said cured resin.
15. The improved method for making an epoxy resin composition according to claim 9 which included the additional step of combining said epoxy resin composition with a fibrous reinforcement.
16. The improved method for making an epoxy resin composition according to claim 15 which includes the additional step of curing said epoxy resin composition to form a cured product comprising said fibrous reinforcement.
17. A composition of matter comprising an epoxy resin composition comprising:
a. an epoxy resin component comprising one or more epoxy resins;
b. a thermoplastic blend comprising polyetherimide and polyamideimide wherein the weight ratio of polyetherimide to polyamideimide is from 5:1 to 1:5 wherein said thermoplastic blend makes up from 15 to 35 weight percent of the total weight of said epoxy resin composition; and
c. a curative agent component.
18. A composition of matter according to claim 17 wherein the weight ratio of polyetherimide to polyamideimide is from 3:1 to 1:3.
19. A composition of matter according to claim 18 wherein the weight ratio of polyetherimide to polyamideimide is from 3:1 to 1:1.
20. A composition of matter according to claim 19 wherein the weight ratio of polyetherimide to polyamideimide is 3:1 and wherein said curing agent consists essentially of a combination of 3,3′-diaminodiphenyl sulphone and 4,4′-diaminodipheny sulphone.
21. A composition of matter according to claim 19 wherein the weight ratio of polyetherimide to polyamideimide is 1:1 and wherein said curing agent consists essentially of a combination of 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone and dicyandiamide.