Electronic circuit device having silicon substrate
View Patent ↗An electronic circuit device comprises a silicon substrate having front and rear surfaces, a semiconductor element formed on the front surface, and at least one through-hole penetrating through the front surface and the rear surface. At least one passive element is supported by the silicon substrate. At least one connecting element is disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element.
1. An electronic circuit device, comprising:
a silicon substrate having a semiconductor element formed on a front surface thereof, a recess formed in a rear surface thereof, and at least one through-hole in the recess and which penetrates through the front surface and the rear surface;
at least one passive element disposed in the recess and formed by a process different from a silicon planar process by which the semiconductor element is formed; and
at least one connecting element disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element, a surface of the connecting element being covered by an insulating resin.
2. An electronic circuit device according claim 1 ; wherein the at least one through-hole comprises a pair of through-holes penetrating through the front and rear surfaces of the silicon substrate; and wherein the at least one connecting element comprises a pair of connecting elements disposed in the respective through-holes of the silicon substrate for electrically connecting the semiconductor element to the passive element, a surface of each of the connecting elements being covered by an insulating resin.
3. An electronic circuit device according claim 2 ; wherein each of the connecting elements comprises a body portion extending in the corresponding through-hole and a head portion extending from one end of the body portion and disposed outside of the through-hole and in the recess for electrical connection to a terminal of the passive element; and wherein the body portion of each of the connecting elements is covered by the corresponding insulating resin.
4. An electronic circuit device according claim 1 ; wherein the connecting element comprises a body portion extending in the through-hole and a head portion extending from one end of the body portion and disposed outside of the through-hole and in the recess for electrical connection to a terminal of the passive element;
and wherein the body portion of the connecting element is covered by the insulating resin.
5. An electronic circuit device comprising:
a silicon substrate having a first main surface, a second main surface opposite the first main surface, a recess formed in the second main surface and having a base portion, and at least one through-hole penetrating through the base portion of the recess and opening to the first main surface;
a semiconductor element formed on the first main surface of the silicon substrate;
at least one passive element disposed in the recess of the silicon substrate; and
at least one connecting element disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element.
6. An electronic circuit device according claim 5 ; wherein the semiconductor element is formed by a silicon planar process; and wherein the passive element is not formed by the silicon planar process from which the semiconductor element is formed.
7. An electronic circuit device according claim 5 ; wherein the at least one through-hole comprises a pair of through-holes penetrating through the base portion of the recess of silicon substrate; and wherein the at least one connecting element comprises a pair of connecting elements disposed in the respective through-holes of the silicon substrate for electrically connecting the semiconductor element to the passive element.
8. An electronic circuit device according claim 7 ; wherein each of the connecting elements comprises a body portion extending in the corresponding through-hole, an insulating resin covering the body portion, and a head portion extending from one end of the body portion and disposed outside of the through-hole and in the recess for electrical connection to a terminal of the passive element.
9. An electronic circuit device according claim 5 ; wherein the connecting element comprises a body portion extending in the through-hole, an insulating resin covering the body portion, and a head portion extending from one end of the body portion and disposed outside of the through-hole and in the recess for electrical connection to a terminal of the passive element.
10. An electronic circuit device according claim 5 ; wherein the passive element is disposed completely within the recess of the silicon substrate.
11. An electronic circuit device according claim 5 ; wherein the passive element comprises a pre-formed structure that is separate and independent from the silicon substrate, the semiconductor element, and the connecting element.
12. An electronic circuit device according claim 5 ; wherein the passive element comprises a pre-formed non-silicon-based passive element.
13. An electronic circuit device according claim 12 ; wherein the connecting element comprises a body portion extending in the through-hole, an insulating resin covering the body portion, and a head portion extending from one end of the body portion and disposed outside of the through-hole and in the recess for electrical connection to a terminal of the passive element.
14. An electronic circuit device according claim 12 ; wherein the connecting element has a surface comprised of an insulating resin.