IP Library Granted Patent US 7,733,613
Granted Patent B2
US 7,733,613 · App. 12/289,380 · Granted Jun 8, 2010

Method for manufacturing a magnetoresistive-effect device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,733,613
App. No.
12/289,380
Granted
Jun 8, 2010
Kind
B2
Abstract

A magnetic disk apparatus having a highly sensitive reproducing head and a method for manufacturing the magnetic disk apparatus are disclosed. A spin-value-type multilayer film composed of an antiferromagnetic layer, a ferromagnetic layer, a nonmagnetic layer and a free magnetic layer is used as a magnoresistive-effect device for the reproducing head. An antiferromagnetic reaction layer is formed between the antiferromagnetic layer and the ferromagnetic layer. The antiferromagnetic reaction layer is formed of a metallic compound containing oxygen.

Claims (19)

1. A method of manufacturing a magnetoresistive-effect device, comprising:

conveying a substrate into a first chamber and forming an antiferromagnetic layer in a vacuum atmosphere in the first chamber;

conveying the substrate into a second chamber and performing vacuum discharge in the second chamber at a degree of vacuum lower than that in the first chamber to form an antiferromagnetic reaction layer on a surface of the antiferromagnetic layer;

removing the substrate from the second chamber and, in another chamber, forming a ferromagnetic layer on the antiferromagnetic reaction layer; and

forming a magnetoresistive-effect film in which the antiferromagnetic reaction layer is between the antiferromagnetic layer and the ferromagnetic layer.

2. The method of manufacturing a magnetoresistive-effect device according to claim 1 , wherein the degree of vacuum in the first chamber is in the range from 1×10 −6 to 1×10 −8 Pa.

3. The method of manufacturing a magnetoresistive-effect device according to claim 1 , wherein the substrate is exposed to the vacuum atmosphere in the second chamber for a time period of 60 seconds or longer.

4. The method of manufacturing a magnetoresistive-effect device according to claim 1 , wherein after the completion of the process in the second chamber, the substrate is again conveyed into the first chamber, and a film forming process of forming the ferromagnetic layer and other layers is thereafter performed.

5. The method of manufacturing a magnetoresistive-effect device according to claim 1 , wherein a helicon long-throw sputtering apparatus is used.

6. A method of manufacturing a magnetoresistive-effect device, the method comprising:

conveying a substrate into a first chamber and forming an antiferromagnetic layer in a vacuum atmosphere in the first chamber;

conveying the substrate into a second chamber and performing a surface treatment using a gas containing 1 ppm or higher of H 2 O or O 2 to form an antiferromagnetic reaction layer;

removing the substrate from the second chamber and, in another chamber, forming a ferromagnetic layer on the antiferromagnetic reaction layer; and

forming a magnetoresistive-effect film in which the antiferromagnetic reaction layer is provided between the antiferromagnetic layer and the ferromagnetic layer.

7. A method of manufacturing a magnetoresistive-effect device, the method comprising:

conveying a substrate into a first chamber and forming an antiferromagnetic layer in a vacuum atmosphere in the first chamber;

conveying the substrate into a second chamber and exposing the substrate to an atmosphere having one of an H 2 O concentration and an O 2 concentration higher than that in the first chamber to form an antiferromagnetic reaction layer;

removing the substrate from the second chamber and in another chamber forming a ferromagnetic layer on the antiferromagnetic reaction layer; and

forming a magnetoresistive-effect film in which the antiferromagnetic reaction layer is between the antiferromagnetic layer and the ferromagnetic layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2014
From: PANASONIC CORPORATION
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 034650/0885 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2014
From: PANASONIC HEALTHCARE CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 032480/0433 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: PANASONIC CORPORATION
To: PANASONIC HEALTHCARE CO., LTD.
Reel/Frame 032360/0795 →