Illumination device comprising a heat sink

1. An illumination device ( 1 ) comprising at least one substrate plate ( 2 ), at least two light-emitting diodes ( 3 ) (LEDs) arranged on the same side (A) of the substrate plate ( 2 ), the LEDs ( 3 ) are each embedded into a housing ( 6 ) placed on the substrate plate in order to dissipate waste heat of the LEDs ( 3 ), and at least one electrically conductive cooling device ( 8 ) arranged on the opposite side (B) of the substrate plate ( 2 ) wherein at least two LEDs ( 3 ) are thermally operatively connected to the cooling device ( 8 ) by means of in each case at least one thermal coupling device ( 9 ) formed from an electrically conductive material,

characterized in that the cooling device ( 8 ) has at least two regions ( 8 a , 8 b , 8 c ) which are electrically isolated from one another, wherein a first region ( 8 b ) is thermally and electrically operatively connected to at least one first LED ( 3 ), and a second region ( 8 a , 8 c ) is thermally and electrically operatively connected to at least one second LED ( 3 ) and

characterized in that at least one mechanical connecting element ( 13 ) is arranged between at least two regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) while maintaining the at least two regions electrically isolated from one another.

2. The illumination device ( 1 ) as claimed in claim 1 , characterized in that at least one region ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) and at least one device ( 9 ) for thermally coupling at least one LED ( 3 ) to the cooling device ( 8 ) are embodied in one piece.

3. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) is fitted to at least one of the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another, by means of a positively locking connection.

4. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) is fitted to at least one of the regions ( 8 a , 9 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another, by means of a force-locking connection.

5. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) is fitted to at least one of the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another, by means of an adhesive bonding connection ( 18 ).

6. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) has at least one section ( 14 , 18 ) formed from a polymer material and serving for electrically insulating the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another.

7. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) has at least one section formed from a ceramic material, and serving for electrically insulating the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another.

8. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) has at least one section formed from a glass material and serving for electrically insulating the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another.

9. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the mechanical connecting element ( 13 ) has at least one section ( 18 ) formed from an adhesive ( 18 ) and serving for electrically insulating the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are electrically isolated from one another, in particular is formed as an adhesive bonding connection ( 18 ).

10. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the side (B) of the substrate plate ( 2 ) which faces the cooling device ( 8 ) is covered substantially, in particular to more than 70%, by the cooling device ( 8 ).

11. The illumination device ( 1 ) as claimed in claim 1 , characterized in that means ( 13 , 18 ) for simply subdividing the substrate plate ( 2 ) into at least two regions ( 8 a , 8 b , 8 c ) which are electrically insulated from one another are provided.

12. The illumination device ( 1 ) as claimed in claim 1 , characterized in that at least two LEDs ( 3 ) arranged on the illumination device ( 1 ) are thermally operatively connected to a common region ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ).

13. The illumination device ( 1 ) as claimed in claim 1 , characterized in that each of the LEDs ( 3 ) arranged on the illumination device ( 1 ) is respectively thermally operatively connected to a region ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) and all the regions ( 8 a , 8 b , 8 c ) of the cooling device ( 8 ) which are respectively operatively connected to an LED ( 3 ) are in each case electrically isolated from one another.

14. The illumination device ( 1 ) as claimed in claim 1 , characterized in that the substrate plate ( 2 ) is embodied as a flexible substrate plate ( 2 ).

15. The illumination device ( 1 ) as claimed in claim 3 , wherein the positively locking connection is at least one of a screw connection, a plug connection and a sliding connection.

16. The illumination, device ( 1 ) as claimed in claim 7 , wherein the ceramic material is at least one of aluminum oxide, aluminum nitrite and zirconium oxide.

17. The illumination device ( 1 ) as claimed in claim 1 , wherein the conductive cooling device is a metallic heat sink.

18. The illumination device ( 1 ) as claimed in claim 4 , wherein the force locking connection is a clamping connection ( 19 ).