Semiconductor device
View Patent ↗A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals.
1. A semiconductor device, comprising:
a resin case having at least one pin;
a plurality of external connection terminals fixedly provided on the resin case;
at least one semiconductor element provided in the resin case; and
at least one terminal block having
at least one wiring terminal for electrically connecting the at least one semiconductor element and at least one of the external connection terminals and
a support substrate for supporting the at least one wiring terminal,
wherein the support substrate has at least one first notch, the first notch being fitted with the at least one pin to fix the at least one terminal block to the resin case.
2. A semiconductor device, comprising:
a resin case;
a plurality of external connection terminals fixedly provided on the resin case;
at least one semiconductor element provided in the resin case;
at least one terminal block having at least one wiring terminal for electrically connecting the at least one semiconductor element and at least one of the external connection terminals; and
an insulating substrate provided in the resin case, and a terminal holder provided on the insulating substrate for supporting the wiring terminal, wherein the terminal block has an extension portion to surround an outer circumference of a connecting portion between the wiring terminal and the terminal holder.
3. A semiconductor device according to claim 1 , wherein the semiconductor element includes a control electrode and a pin terminal conductively connected to the control electrode, and the terminal block has a second notch for supporting the pin terminal.
4. A semiconductor device according to claim 1 , wherein the terminal block has a shield layer disposed selectively thereon.
5. A semiconductor device according to claim 1 , wherein the semiconductor device has a plurality of said terminal blocks, each terminal block having the wiring terminal so that the wiring terminals are sterically arranged.
6. A semiconductor device according to claim 1 , wherein the support substrate is formed of a resin or a ceramic as a main component.
7. A semiconductor device according to claim 1 , wherein the wiring terminal is insert-molded into the terminal block.
8. A semiconductor device, comprising:
a resin case;
a plurality of external connection terminals fixedly provided on the resin case;
a semiconductor element provided in the resin case;
an insulating substrate fixed in the resin case;
a wiring terminal for electrically connecting the semiconductor element and at least one of the external connection terminals, the wiring terminal being disposed under the insulating substrate and partly fixed thereto; and
a terminal holder disposed under the wiring terminal for connecting the at least one external connection terminal and the semiconductor element through the wiring terminal.
9. A semiconductor device according to claim 8 , further comprising another semiconductor element situated adjacent to the semiconductor element, the terminal holder being disposed in a middle of the resin case to electrically be connected to the another semiconductor element.