Carrier body for components or circuits
A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive. In order to simplify the carrier body while at the same time providing extremely improved heat dissipation, the invention process that the carrier body is provided integrally with heat-dissipating or heat-supplying cooling elements.
1. A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive, and the carrier body being provided integrally with heat-dissipating or heat-supplying cooling elements, wherein the carrier body is a printed circuit board, the carrier body and the cooling element comprise a ceramic or a composite material, and the composite material contains electrically nonconductive or virtually nonconductive matrix materials with heat-conducting aggregates, and sintered metallization regions are applied to the surface of the carrier body.
2. A carrier body according to claim 1 , wherein at least one mounting option is connected to the carrier body or cooling element.
3. A carrier body according to claim 1 , wherein the cooling element bears a desired surface structuring which result in the effect of altering the surface.
4. A carrier body according to claim 1 , wherein the carrier body is connected to metal layers >5 μm thick.
5. A carrier body according to claim 1 , wherein the carrier body is used as a heat source wherein the heat produced is provided to a medium having a temperature, and wherein the whose temperature is regulated via the carrier body or the cooling element.
6. A carrier body according to claim 1 , wherein one or more light-emitting substances or one or more light-emitting components or a combination thereof are connected to the carrier body.
7. A carrier body according to claim 1 , wherein the carrier body is connected to at least one further geometrically identical or different carrier body via connecting materials to form a type of three-dimensional array.
8. A carrier body according to claim 1 , wherein the carrier body is connected to one or more light-emitting substances or one or more light-emitting components and combinations thereof and is also provided with standardized or nonstandardized electrical connectors.
9. A carrier body according to claim 8 , wherein the electrical connectors are lamp bases.
10. A carrier body according to claim 1 , wherein at least one different or identical carrier body are embedded in a matrix material with a desired orientation.
11. A carrier body according to claim 1 , wherein, in a carrier body, a change in heat transport is achieved by modifying the size or the coloring or the metallized regions or the geometry or changing in cooling elements or number of cooling elements or a combination thereof.
12. A carrier body according to claim 1 , wherein the carrier body does not have any screening effect or has little screening effect with respect to electrical or magnetic or electromagnetic fields or combinations of these, and therefore these fields can also pass through the carrier body.
13. A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive, and the carrier body being provided integrally with heat-dissipating or heat-supplying cooling elements, wherein the carrier body is a printed circuit board, the carrier body and the cooling element comprise a ceramic or a composite material, and the composite material contains electrically nonconductive or virtually nonconductive matrix materials with heat-conducting aggregates, and sintered metallization regions are applied to the surface of the carrier body, wherein the sintered metallization regions consist of tungsten and are chemically nickel-plated.
14. A carrier body for electrical or electronic component elements or circuits, the carrier body being electrically nonconductive or virtually nonconductive, and the carrier body being provided integrally with heat-dissipating or heat-supplying cooling elements, wherein the carrier body is a printed circuit board, the carrier body and the cooling element comprise a ceramic or a composite material, and the composite material contains electrically nonconductive or virtually nonconductive matrix materials with heat-conducting aggregates, and a plurality of circular sintered metallization regions are applied to the surface of the carrier body, wherein the sintered metallization regions consist of tungsten and are chemically nickel-plated.