IP Library Granted Patent US 8,319,105
Granted Patent B2
US 8,319,105 · App. 12/295,826 · Granted Nov 27, 2012

Wire-in-channel superconductor

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Quick Facts
Patent No.
US 8,319,105
App. No.
12/295,826
Granted
Nov 27, 2012
Kind
B2
Abstract

In a method of manufacturing a copper clad aluminum channel superconductive conductor, an electrically conductive wire comprising a metal or alloy core is formed with a longitudinally extending groove in a surface thereof. A wire made of a material that exhibits superconducting properties within a defined temperature range is soldered into the groove.

Claims (19)

1. A method of manufacturing a copper clad aluminum channel superconductive conductor, said method comprising:

fabricating, from an electrically conductive wire having a substantially circular cross-section, a metallic channel in the form of a longitudinally extending groove in a surface of the electrically conductive wire using wire drawing or shaping techniques, wherein the electrically conductive wire includes an outer layer of copper with a substantially circular cross-section that encases a layer of high strength alloy with a substantially circular cross-section, which in turn encases an aluminum wire with a substantially circular cross-section; and

soldering into said groove a wire which comprises a material that exhibits superconducting properties within a defined temperature range.

2. The method according to claim 1 , wherein a further elongate member is included with the wire in the channel when forming the copper clad aluminum channel superconductive conductor, to mechanically strengthen the channel conductor.

3. The method according to claim 2 wherein the further elongate member is incorporated in a linear or spiral fashion prior to, during or after the solder operation.

4. The method according to claim 1 , wherein said wire comprises a number of filaments of a material that exhibits superconducting properties within a defined temperature range in a normally-conductive matrix material.

5. The method according to claim 4 , wherein said matrix material comprises copper.

6. The method according to claim 1 , further comprising the step of at least partially tinning the outer layer of copper of the metallic channel at least in and near the groove, prior to soldering the wire into the groove.

7. The method according to claim 1 , wherein a further elongate member is incorporated into the channel conductor before, during or after the solder bonding of the wire to the channel, to improve thermal stability.

8. The method of claim 7 wherein the further elongate member is treated to accept solder.

9. A channel conductor comprising:

a metallic channel having a longitudinally extending groove in a surface thereof and

a wire soldered into said groove; wherein,

said wire comprises a material that exhibits superconducting properties within a defined temperature range; and

said metallic channel is fabricated from an electrically conductive wire having a substantially circular cross-section using wire drawing or shaping techniques, wherein the electrically conductive wire includes an outer layer of cooper with a substantially circular cross-section that encases a layer of high strength alloy with a substantially circular cross-section, which in turn encases an aluminum wire with a substantially circular cross-section.

10. The channel conductor according to claim 9 , wherein said wire comprises a number of filaments of a material that exhibits superconducting properties within a defined temperature range in a normally-conductive matrix material.

11. The channel conductor according to claim 10 , wherein said matrix material comprises copper.

12. The channel conductor according to claim 9 , wherein the outer layer of copper of the metallic channel is at least partially tinned, at least in and near the groove.

13. A channel conductor according to claim 9 , wherein a further elongate member is incorporated into the channel conductor, to improve thermal stability.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Oct 20, 2016
From: HSBC BANK, PLC AS AGENT AND SECURITY TRUSTEE
To: OXFORD INSTRUMENTS OST ASSET CO LLC
Reel/Frame 040077/0040 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2012
From: THOMAS, ADRIAN MARK; HONG, SEUNGOK
To: SIEMENS MAGNET TECHNOLOGY LTD.; OXFORD SUPERCONDUCTING TECHNOLOGY
Reel/Frame 028825/0455 →
SECURITY AGREEMENT Recorded Jul 7, 2010
From: OXFORD INSTRUMENTS OST ASSET CO LLC
To: HSBC BANK PLC
Reel/Frame 024640/0651 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2009
From: SIEMENS MAGNET TECHNOLOGY LIMITED
To: SIEMENS PLC
Reel/Frame 023220/0438 →