Polyamide resin
View Patent ↗To provide a polyamide resin excellent in lasting thermal stability and having a high biomass ratio. A polyamide resin comprising adipic acid units, pentamethylenediamine units and 6-aminocaproic acid units as constituents, wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 97:3 to 75:25. The pentamethylenediamine is preferably one produced from lysine using lysine decarboxylase, lysine decarboxylase-producing cells or a treated product of the cells.
1. A polyamide resin comprising adipic acid units, pentamethylenediamine units and 6-aminocaproic acid units, wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 85:15 to 75:25 wherein the total contents of the adipic acid units, the pentamethylenediamine units and the 6-aminocaproic acid units is at least 90 wt % of the polyamide resin.
2. The polyamide resin according to claim 1 , wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 85:15 to 80:20.
3. The polyamide resin according to claim 1 , wherein the pentamethylenediamine is produced from lysine using lysine decarboxylase, lysine decarboxylase-producing cells or a treated product of the lysine decarboxylase-producing cells.
4. The polyamide resin according to claim 1 , wherein a biomass ratio is at least 30.8 wt %.
5. The polyamide resin according to claim 1 , wherein the relative viscosity of a 98 wt % sulfuric acid solution of the polyamide resin (polyamide resin concentration: 0.01 g/ml) at 25° C. is from 1.5 to 8.0.
6. A polyamide film comprising the polyamide resin as defined in claim 1 .
7. A polyamide filament comprising the polyamide resin as defined in claim 1 .
8. The polyamide resin according to claim 1 , wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 85:15 to 82:18.
9. The polyamide resin according to claim 1 , wherein the total contents of the adipic acid units, the pentamethylenediamine units and the 6-aminocaproic acid units is at least 95 wt % of the polyamide resin.
10. The polyamide resin according to claim 1 , wherein the relative viscosity of a 98 wt % sulfuric acid solution of the polyamide resin (polyamide resin concentration: 0.01 g/ml) at 25° C. is from 1.8 to 5.0.
11. The polyamide resin according to claim 1 , wherein said polyamide has a melting point of from 210 to 255° C.
12. The polyamide resin according to claim 1 , wherein said polyamide has a melting point of from 220 to 250° C.
13. The polyamide resin according to claim 1 , further comprising 0.005 to 0.1 pbw of an inorganic filler per 100 pbw of said polyamide resin.