IP Library Granted Patent US 9,303,152
Granted Patent B2
US 9,303,152 · App. 12/302,208 · Granted Apr 5, 2016

Use of microwave energy to selectively heat thermoplastic polymer systems

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Quick Facts
Patent No.
US 9,303,152
App. No.
12/302,208
Granted
Apr 5, 2016
Kind
B2
Abstract

A method for processing a thermoplastic material that comprises a microwave-sensitive polymeric region, wherein the method includes exposing the microwave-sensitive polymeric region to microwaves; wherein the exposing results in an increase in the temperature of the polymeric region; and processing the thermoplastic material is disclosed.

Claims (19)

1. A method for processing a microwave-sensitive thermoplastic material, the method comprising:

admixing at least one thermoplastic material that is substantially transparent to microwave energy and at least one microwave-receptive additive to form a microwave-sensitive thermoplastic material;

removing water from the at least one microwave-receptive additive;

passing the microwave-sensitive thermoplastic material through a microwave heating apparatus;

exposing the microwave-sensitive thermoplastic material to microwaves in the microwave heating apparatus to increase the temperature of the microwave-sensitive thermoplastic material; and

melt processing the microwave-sensitive thermoplastic material, and

wherein each microwave-receptive additive is selected from the group consisting of zeolites, hydrated minerals, clays, and clays modified with microwave-receptive compounds.

2. The method of claim 1 , wherein the microwave-receptive additive has a receptive nature over a frequency in a range from 1 MHz to 300 GHz.

3. The method of claim 2 , further comprising tuning a microwave wavelength emitted from the microwave heating apparatus.

4. The method of claim 1 , further comprising disposing the microwave-sensitive thermoplastic material as a layer in a multi-layered composite.

5. The method of claim 4 , wherein the multi-layered composite comprises the microwave-sensitive thermoplastic material layer and at least one microwave-transparent layer.

6. The method of claim 5 , wherein the multi-layered composite has a total thickness from 100 microns to 25 mm.

7. The method of claim 5 , wherein the multi-layered composite comprises a core of the microwave-sensitive thermoplastic material layer bounded by microwave-transparent outer layers.

8. The method of claim 7 , wherein the removing water from the at least one microwave-receptive additive comprises drying the layered sheet, forming the layered sheet in a vented extruder, drying the microwave-receptive additive, or combinations thereof.

9. The method of claim 7 , further comprising using the multi-layered composite as a component in a refrigerator.

10. The method of claim 1 , wherein the melt-processing is selected from the group consisting of injection molding, extrusion, extrusion-blow molding, transfer molding, blow molding, injection-expansion molding, thermoforming, sheet extrusion, co-extrusion, foam extrusion, foam molding, injection-stretch blow molding, and combinations thereof.

11. The method of claim 10 , wherein the melt-processing results in at least one of films, foams, profiles, compounded pellets, fibers, woven fabrics, non-woven fabrics, yarns, molded parts, composites, and laminates.

12. The method of claim 11 , wherein the woven or non-woven fabrics further comprise cellulosic fibers.

13. The method of claim 1 , wherein the microwave-receptive additive further comprises at least one additional microwave-receptive additive selected from the group consisting of metals, metal salts, metal oxides, carbon, hydrated salts of metal compounds, polymeric receptive materials, silicates, ceramics, sulfides, titanates, carbides, sulfur, inorganic solid acids or salts, polymer acids or salts, inorganic or polymeric ion exchangers, inorganic or polymeric substances which contain a molecular or polymer microwave receptor, and organic conductors.

Assignments (7)
CHANGE OF NAME Recorded Jul 31, 2012
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 028687/0415 →
CHANGE OF NAME Recorded Mar 18, 2011
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 025981/0498 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2008
From: SALMANG, RODOLFO; VAN DAELE, RONALD
To: DOW BENELUX B.V.
Reel/Frame 021883/0765 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2008
From: LAI, SHIH-YAW; COOK, MICHAEL
To: DCOMCO, INC.
Reel/Frame 021883/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2008
From: BONGARTZ, HERBERT; MAYER, ANDREAS; DCOMCO, INC.
To: DOW EUROPE GMBH
Reel/Frame 021883/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2008
From: DOW BENELUX B.V.; DOW EUROPE GMBH
To: THE DOW CHEMICAL COMPANY
Reel/Frame 021883/0975 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2008
From: THE DOW CHEMICAL COMPANY; HALEY, ROBERT P., JR.; PAQUETTE, MICHAEL S.; MERCURE, PETER K.; CRABTREE, SAM L.; SUGDEN, JOHN L.; LONGORIA, JOSE J.; SIAVOSHANI, SAEED; WATKINS, JEFF
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 021884/0089 →