IP Library Granted Patent US 8,205,534
Granted Patent B2
US 8,205,534 · App. 12/306,924 · Granted Jun 26, 2012

Cutting methods and cutting apparatus

Assignee: Nagasaki University
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,205,534
App. No.
12/306,924
Granted
Jun 26, 2012
Kind
B2
Abstract

The present invention provides cutting methods and cutting apparatus that can precisely cut workpieces in complicated shapes with high aspect ratios regardless of materials of the workpieces. The present invention is cutting methods and cutting apparatus using a wire saw wherein cutting processing is performed for a workpiece by extending a cutting wire on a cutting arm that rotates around a wire's center axis or a real cutting position relative to a fixed section and rotating the cutting arm such that a cutting direction of the wire matches a support direction of a total stiffness that supports the wire.

Claims (33)

1. A cutting method using a wire saw, characterized in that the cutting method comprises:

providing a fixed base having a rotatable portion,

providing a cutting arm mounted on the rotatable portion, the cutting arm extending a working portion of a traveling cutting wire across a workpiece; and

using a control mean to control the rotatable portion to rotate the cutting arm around a center axis of the working portion of the wire, the control means compensating for deflection of said wire when a workpiece is cut, the control means rotating the cutting arm such that a cutting direction of the wire matches an arm support direction to increase the stiffness of the wire; and

performing cutting processing for a workpiece.

2. The cutting method as set forth in claim 1 ,

characterized in that cutting method further comprises: extending the wire between a pair of grooved guide rollers disposed on the cutting arm; and traveling the wire.

3. The cutting method as set forth in claim 1 ,

characterized in that the cutting method further comprises:

detecting a displacement amount between the center of rotation of the cutting arm and a real cutting position of the wire; and controlling the wire cutting position

such that it matches the center of rotation of the cutting arm based on the displacement amount.

4. The cutting method as set forth in claim 3 ,

characterized in that controlling the real cutting position of the wire is performed by detecting a tension of the wire.

5. The cutting method as set forth in claim 3 ,

characterized in that controlling the real cutting position of the wire is performed by directly detecting the real cutting position.

6. A wire saw cutting apparatus comprising:

a fixed base having a rotatable portion,

a cutting arm mounted on the rotatable portion, the cutting arm configured to extend a cutting wire such that a working portion of the wire is exposed across a workpiece receiving gap; and

a control means configured to rotate the cutting arm around a center axis of the working portion of the wire, the control compensating for deflection of said wire when a workpiece is cut, the control means rotating the cutting arm such that a cutting direction of the wire matches an arm support direction to increase the stiffness of the wire.

7. The wire saw cutting apparatus as set forth in claim 6 ,

characterized in that the wire saw cutting apparatus further comprises: a cutting wire supply/collection unit, a pair of grooved guide rollers that guide the wire being disposed on the cutting arm, the wire being extended between the pair of grooved guide rollers such that the wire reciprocally travels therebetween.

8. A wire saw cutting apparatus as set forth in claim 6 ,

characterized in that the wire saw cutting apparatus further comprises:

an X-Y moving mechanism disposed on the rotatable portion and on which the cutting arm is fixed; the control means controlling the X-Y moving mechanism, when a workpiece is cut, the X-Y moving mechanism being controlled such that a center of rotation of the cutting arm matches a real cutting position where the wire always contacts the workpiece.

9. The wire saw cutting apparatus as set forth in claim 8 ,

characterized in that the wire saw cutting apparatus further comprises:

a cutting wire supply/collection unit, a pair of grooved guide rollers that guide the wire being disposed on the cutting arm, the wire being extended between the pair of grooved guide rollers such that the wire reciprocally travels therebetween.

10. The wire saw cutting apparatus as set forth in claim 8 ,

characterized in that a displacement amount between the center of rotation of the cutting arm and the real cutting position of the wire is detected, the X-Y moving mechanism is controlled by the control means based on the displacement amount, and the real cutting position of the wire is matched with the center of rotation of the cutting arm.

11. The wire saw cutting apparatus as set forth in claim 8 ,

characterized in that a strain sensor configured to detect the real cutting position of the wire from a tension of the wire is disposed on the cutting arm.

12. The wire saw cutting apparatus as set forth in claim 8 ,

characterized in that the wire saw cutting apparatus further comprises: optical detection means for detecting the real cutting position of the wire.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2013
From: NAGASAKI UNIVERSITY
To: KOMATSU NTC LTD.
Reel/Frame 030339/0350 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2009
From: YAZAWA, TAKANORI; ISHIKAWA, KEIICHI; MINETA, KOU
To: NAGASAKI UNIVERSITY
Reel/Frame 023144/0551 →
Priority Claims (1)
JP P2006-182387 · Jun 30, 2006 · national
Continuity (1)
Related Publication 20090320658A1 · Dec 31, 2009