Thermally polymerizable resin composition
View Patent ↗A water-soluble thermally polymerizable oxetane resin composition comprises (A) a water-soluble oxetane compound and (B) at least one heteropolyacid compound selected from heteropolyacids and heteropolyacid salts. The water-soluble oxetane compound may contain one or more oxetane functional groups in the molecule and one or more alcoholic OH groups in the molecule. The heteropolyacids include phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, silicomolybdic acid or mixtures thereof. The heteropolyacid salts include phosphotungstic acid salts, phosphomolybdic acid salts, silicotungstic acid salts, silicomolybdic acid salts or mixtures thereof.
1. A thermally polymerizable resin composition comprising (A) a water-soluble oxetane compound having one or more hydroxyl groups as a main component, (B) a heteropolyacid compound as a polymerization catalyst, and (C) an aqueous medium containing 50 wt % or more of water, wherein the water-soluble oxetane compound is selected from the oxetane compounds represented by formulas (5), (7), (8), and (10), the heteropolyacid compound is at least one selected from heteropolyacids and heteropolyacid salts, the heteropolyacid compound is incorporated in an amount in the range of 0.01 to 10 parts by weight per 100 parts by weight of the water-soluble oxetane compound, and the water-soluble oxetane compound and the heteropolyacid compound are fully dissolved in said aqueous medium to be a homogeneous solution;
wherein, R is independently a hydrogen atom or an alkyl group of 1 to 6 carbon atoms; and wherein upon completion of the polymerization of the thermally polymerizable resin composition, the resulting polymer is essentially linear.
2. A thermally polymerizable resin composition as described in claim 1 wherein the heteropolyacid is phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, silicomolybdic acid, or a mixture thereof.