Evaporation apparatus and thin film forming method using the same
View Patent ↗Provided are an evaporation apparatus and a thin film forming method using the same. The evaporation apparatus and the thin film forming method are used to form a uniform thin film, even for a large substrate, and can be easily employed without changing equipment even if a substrate size is changed. The evaporation apparatus includes a first evaporation source, a second evaporation source separated from the first evaporation source, and a compensation member disposed between a target object and the first and second evaporation sources. The compensation member performs a linear movement simultaneously with the first and second evaporation sources. The compensation member includes a first compensation plate disposed in a position corresponding to the first evaporation source, and a second compensation plate disposed in a position corresponding to the second evaporation source.
1. An evaporation apparatus comprising:
a first evaporation source;
a second evaporation source being separated from the first evaporation source, the first and second evaporation sources being capable of simultaneously moving in a moving direction; and
a compensation member disposed in a space formed between a substrate and the first and second evaporation sources, the compensation member being capable of moving in the moving direction simultaneously with the first and second evaporation sources, the compensation member comprising:
a first compensation plate disposed in a position closer to the first evaporation source than the second evaporation source;
a second compensation plate disposed in a position closer to the second evaporation source than the first evaporation source; and
a support unit connecting the first compensation plate to the second compensation plate, none of the first and second compensation plates and the support unit covering a line imaginarily connecting the first evaporation source to the second evaporation source.
2. The evaporation apparatus of claim 1 , wherein the first compensation plate protrudes from the support unit towards a line that is imaginarily drawn from the first evaporation source perpendicularly to the substrate, the second compensation plate protruding from the support unit towards a line that is imaginarily drawn from the second evaporation source perpendicularly to the substrate.
3. The evaporation apparatus of claim 1 , wherein each of the first compensation plate and the second compensation plate is parallel to a surface of the substrate facing the first evaporation source and the second evaporation source.
4. The evaporation apparatus of claim 1 , wherein the first evaporation source and the second evaporation source perform a reciprocating linear movement.
5. The evaporation apparatus of claim 1 , wherein the second evaporation source is separated from the first evaporation source in a direction substantially perpendicular to the moving direction.
6. A method for forming a thin film, comprising;
arranging a first evaporation source and a second evaporation source that is separated from the first evaporation source, the first and second evaporation sources being capable of simultaneously moving in a moving direction;
placing substrate to face the first and second evaporation sources;
partially shielding a space formed between a substrate and the first and second evaporation sources by disposing a compensation member in the space formed between the substrate and the first and second evaporation sources, the compensation member being capable of moving in the moving direction simultaneously with the first and second evaporation sources, the compensation member comprising:
a first compensation plate disposed in a position closer to the first evaporation source than the second evaporation source;
a second compensation plate disposed in a position closer to the second evaporation source than the first evaporation source; and
a support unit connecting the first compensation plate to the second compensation plate, none of the first and second compensation plates and the support unit covering a line imaginarily connecting the first evaporation source to the second evaporation source;
and forming a thin film on the substrate while simultaneously moving the first and second evaporation sources in the moving direction.
7. The method of claim 6 , wherein an amount of an evaporation material shielded by the first compensation plate or the second compensation plate is greater than an amount of an evaporation material shielded by the support unit.
8. The method of claim 6 , wherein partially shielding the space formed between the substrate and the first and second evaporation sources comprising:
placing the first compensation plate in a first space formed between the substrate and the first evaporation source; and
placing the second compensation plate in a second space formed between the substrate and the second evaporation source.
9. The method of claim 8 , wherein the step of forming the thin film includes a step of forming a thin film on the substrate while reciprocating the first and second evaporation sources simultaneously with the first and second compensation plates.
10. The method of claim 6 , wherein the first and second evaporation sources are separated in a direction substantially perpendicular to the moving direction.